Micromagnetic Core Plating Structure to Prevent Edge Horns

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Solution Overview

Problem

Current micromagnetic devices face challenges in achieving smaller sizes and higher operating efficiencies, with difficulties in manufacturing micromagnetic devices with low costs and avoiding pattern edge 'horns' during electroplating, which affect manufacturing yields and product reliability.

Innovation Solution

A micromagnetic device is designed with a quaternary alloy including iron, cobalt, boron, and phosphorus, and a method involving multiple seed and electroplated layers with insulating layers to prevent edge formation, enhancing magnetic properties and manufacturing repeatability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If thick electroplating is used to achieve high power conversion efficiency, then magnetic performance improves, but pattern edge 'horns' form during the process

Engineering Contradiction:
Improvemagnetic performanceVSAvoidpattern edge uniformity
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent divides the electroplating process into multiple sequential steps with different plating solutions and parameters. The first plating step uses a initial solution to build base thickness, followed by additional plating steps that progressively add magnetic material. This segmentation prevents the formation of pattern edge horns that occur in single-step thick plating, while still achieving the required thickness for high power conversion efficiency and magnetic performance.

Inventive Principle:
Principle #1Segmentation

2Volume of moving object

If smaller device dimensions are produced to meet compact design requirements, then device size reduces, but manufacturing complexity increases

Engineering Contradiction:
Improvedevice sizeVSAvoidmanufacturing complexity
Core Design Contradiction:
Volume of moving objectVSDevice complexity

Solution Approach 1:

The patent integrates multiple functional layers (seed layer, magnetic layers, insulating layers, conductive layers) in a nested configuration where each layer serves multiple purposes. The seed layer provides both adhesion and initial current distribution, while subsequent magnetic layers are deposited in a nested sequence that builds up the magnetic core structure. This nesting approach enables compact device dimensions while managing manufacturing complexity through a systematic layer-by-layer process.

Inventive Principle:
Principle #7Nested doll (Nesting)

3Reliability

If multiple seed and electroplated layers are used to improve magnetic properties, then magnetic saturation flux density increases, but manufacturing process complexity increases

Engineering Contradiction:
Improvemagnetic saturation flux densityVSAvoidmanufacturing process complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent achieves high magnetic saturation flux density by systematically changing parameters across multiple layers including material composition (Fe-Co-B-P alloy ratios), layer thicknesses, and electroplating conditions (current density, temperature, pH). Each layer is optimized with specific parameter ranges that collectively deliver superior magnetic properties. The method manages manufacturing complexity by establishing controlled parameter windows that ensure repeatability and consistent magnetic performance across production batches.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables the production of micromagnetic devices with improved magnetic saturation flux density and operational life, accommodating high switching frequencies with low power dissipation and cost-effective manufacturing.

Implementation Method 1

a first electroplated layer segment electroplated over and laterally beyond the first seed layer segment

Methodology Applied
Scientific EffectElectroplating: Electroplating

Data Source

PatentUS20240234001A1Micromagnetic device and method of forming the same
Publication Date: 2024.07.11 ENACHIP INC
  • US20240234001A1 patent drawing
  • US20240234001A1 patent drawing
  • US20240234001A1 patent drawing

AI summary

A micromagnetic device and method of forming the same. In one embodiment, the micromagnetic device includes a seed layer formed over a substrate, and a patterned insulating layer and a patterned protective layer formed over the seed layer providing a first exposed section of the seed layer. The micromagnetic device also includes a first electroplated layer segment electroplated over the first exposed section of the seed layer and laterally over sections of the patterned insulating layer and the patterned protective layer.