Reusable Electrostatic Chuck via Selective Dielectric Layer Regeneration
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Solution Overview
Problem
The existing methods for reusing electrostatic chucks in semiconductor manufacturing are time-consuming and costly due to the need to regenerate the entire dielectric layer, including the DC electrode and heater electrode, which involves patterning and laminating new dielectric layers.
Innovation Solution
A method for manufacturing a reusable electrostatic chuck by removing only the upper part of the dielectric layer where electrodes are not formed, depositing a new dielectric layer using an aerosol deposition process, and patterning it to match the original configuration, thereby reducing the need for extensive electrode re-patterning and lamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the entire dielectric layer is removed and regenerated to reuse the electrostatic chuck, then the electrostatic chuck can be reused, but the process becomes time-consuming and expensive due to the need to pattern electrodes again and laminate a dielectric layer
Solution Approach 1:
The dielectric layer regeneration process is segmented into selective removal of only the upper damaged portion rather than removing the entire dielectric layer. This allows the lower intact dielectric layer and electrodes to be preserved, significantly reducing the regeneration time and cost while maintaining the electrostatic chuck's functionality
Solution Approach 2:
Only the necessary upper portion of the dielectric layer that contains damage or contamination is extracted and removed, while the rest of the dielectric layer and underlying electrodes are retained. This selective extraction avoids the need to re-pattern electrodes and re-laminate the entire dielectric layer
2Reliability
If the entire dielectric layer is removed and regenerated to reuse the electrostatic chuck, then the electrostatic chuck can be reused, but the process becomes expensive due to the need to pattern electrodes again and laminate a dielectric layer
Solution Approach 1:
The regeneration process is divided into selective steps where only the damaged upper dielectric layer is removed and a new dielectric layer is deposited only in that region. This segmentation eliminates expensive steps such as electrode re-patterning and full dielectric layer lamination, reducing manufacturing costs
Solution Approach 2:
Instead of performing the complete regeneration process (removing and re-laminating the entire dielectric layer), only the necessary partial action of removing and regenerating the upper damaged portion is performed, achieving the required functionality at lower cost
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces the time and cost associated with reusing electrostatic chucks by minimizing the need for electrode re-patterning and lamination, while enhancing the electrostatic chucking force and etching resistance through the use of materials like aluminum nitride, silicon carbide, or aluminum oxide.
Implementation Method 1
The depositing may comprise depositing the second dielectric layer on the first dielectric layer using an aerosol deposition process
Data Source
AI summary
Provided are an electrostatic chuck, which is manufactured to be reusable by removing a part of a dielectric layer except for a DC electrode and a heater electrode and depositing a new dielectric layer thereon, and a method for manufacturing the electrostatic chuck, and a substrate processing system including the electrostatic chuck. The method for manufacturing the electrostatic chuck includes, after using an electrostatic chuck, removing a portion of an upper part of a first dielectric layer of the electrostatic chuck where an electrode is not formed, depositing a second dielectric layer on the first dielectric layer from which the portion of the upper part has been removed, and patterning the second dielectric layer to enable reuse of the electrostatic chuck.