Electrostatic Chuck Temperature Control for Ion Implantation
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Solution Overview
Problem
Conventional ion implantation systems face challenges in maintaining uniform temperature control across workpieces due to differing heat transfer capabilities of electrostatic chucks for high temperature and quasi-room temperature implants, leading to variations in implant temperature and inefficiencies during startup operations.
Innovation Solution
A system and method utilizing a high temperature electrostatic chuck configured to operate in both high temperature and quasi-room temperature modes, with a controller managing the heating system to maintain consistent temperatures by transferring energy between the workpiece and the chuck, allowing for efficient energy management and uniform temperature control across various implantation processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a low-heat chuck is used for quasi-room temperature implants, then the workpiece can be heated to the desired temperature, but temperature fluctuations occur during implantation causing variations in implant homogeneity
Solution Approach 1:
Instead of using a low-heat chuck that heats the workpiece (causing temperature fluctuations), the invention inverts the approach by using a high temperature chuck that is actively cooled. The chuck maintains a high temperature and removes heat from the workpiece during implantation, preventing temperature rise and ensuring implant homogeneity.
Solution Approach 2:
The invention changes the operational parameters of the chuck by enabling it to operate in multiple temperature regimes (high temperature mode for quasi-room temperature implants, and cooling mode for hot implants). The chuck temperature and cooling power are dynamically adjusted to maintain precise workpiece temperature control during different implantation processes.
2Temperature
If a high temperature electrostatic chuck is used for hot implants, then high temperature processing can be achieved, but the chuck cannot be used for quasi-room temperature implants without configuration changes
Solution Approach 1:
The invention makes the electrostatic chuck universal by enabling it to perform multiple functions: it can conduct hot implants by heating the workpiece to high temperatures (300-600°C), and it can conduct quasi-room temperature implants by actively cooling the workpiece. The single chuck design with integrated heating and cooling capabilities eliminates the need for configuration changes between different implantation processes.
3Temperature
If a chilled chuck is used for cold implants, then the workpiece can be cooled, but the system requires separate chucks for different temperature regimes increasing complexity
Solution Approach 1:
The invention merges the heating and cooling functions into a single electrostatic chuck. The chuck integrates heating elements and cooling channels, allowing it to perform hot implants, quasi-room temperature implants, and cold implants without requiring separate chucks or configuration changes. This unified design reduces system complexity while maintaining full temperature regime coverage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the performance of both high temperature and quasi-room temperature implants using the same electrostatic chuck, reducing configuration changes and improving productivity by maintaining a constant temperature, thereby mitigating temperature variations and enhancing the homogeneity of implants.
Implementation Method 1
a first cooling channel extending through the electrostatic chuck from a first side of the electrostatic chuck to a second side of the electrostatic chuck
Implementation Method 2
a gas interface conventionally provides a thermal interface from the clamping surface to the backside of the workpiece
Data Source
AI summary
An ion implantation system has a first chamber and a process chamber with a heated chuck. A controller transfers the workpiece between the heated chuck and first chamber and selectively energizes the heated chuck first and second modes. In the first and second modes, the heated chuck is heated to a first and second temperature, respectively. The first temperature is predetermined. The second temperature is variable, whereby the controller determines the second temperature based on a thermal budget, an implant energy, and/or an initial temperature of the workpiece in the first chamber, and generally maintains the second temperature in the second mode. Transferring the workpiece from the heated chuck to the first chamber removes implant energy from the process chamber in the second mode. Heat may be further transferred from the heated chuck to a cooling platen by a transfer of the workpiece therebetween to sequentially cool the heated chuck.