Electrostatic Chuck Ring Layout for Stable Plasma Heating
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Solution Overview
Problem
Existing electro-static chucks face issues with reliability due to wide overlap between regions affected by the heating plate and second ring, leading to inconsistencies in plasma processing and reduced process reliability.
Innovation Solution
The electro-static chuck design minimizes the overlap between regions affected by the heating plate and second ring by strategically arranging the second ring to maintain a horizontal distance of at least 3.5 mm, ensuring minimal overlap and controlled plasma formation through a movable second ring driven by a vertical pin mechanism.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the second ring is positioned closer to the heating plate, then plasma shape control is improved, but overlap between heated region and plasma-affected region increases causing process inconsistencies
Solution Approach 1:
The second ring is made movable in the vertical direction through a pin mechanism that allows it to move between a first position (closer to heating plate) and a second position (farther from heating plate). This dynamic positioning enables optimization of plasma shape control while minimizing overlap with the heated region, thereby resolving the contradiction between manufacturing precision and reliability.
2Device complexity
If the second ring is fixed in position, then device complexity is reduced, but adaptability to different processing requirements is limited
Solution Approach 1:
The second ring is designed with vertical movability through a simple pin mechanism that allows position adjustment between two discrete locations. This dynamic feature provides adaptability for different plasma shape requirements without introducing complex continuous adjustment mechanisms, thus balancing device complexity with versatility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances plasma processing reliability by reducing discontinuities and process distribution, thereby improving the overall efficiency and consistency of substrate processing.
Implementation Method 1
a heating plate configured to discharge heat from a lower portion of the chuck plate to heat the substrate
Implementation Method 2
An electro-static chuck may include a heating plate for heating a substrate
Data Source
AI summary
An electro-static chuck includes a chuck plate configured to seat a substrate, an insulating pillar on the outside of the chuck plate, a first ring surrounding a side portion of the chuck plate on the insulating pillar, a second ring covering at least a portion of an upper portion of the first ring, and a heating plate configured to discharge heat from a lower portion of the chuck plate to heat the substrate, wherein the second ring is arranged such that an overlap of a first region of the substrate affected by the heating plate and a second region of the substrate affected by the second ring is minimized.