Electrostatic Chuck Sealing Member Protects Bonding Layers

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Solution Overview

Problem

Existing substrate processing apparatuses face challenges in protecting the bonding layers from radicals and heat transmitting gases, leading to potential deterioration and peeling of electrostatic chucks, which affects the stability and longevity of the apparatus during plasma processing.

Innovation Solution

A stage design incorporating a sealing member that protects the first and second bonding layers by sealing gaps between the electrostatic chucks and the edge ring, preventing radicals and heat transmitting gases from reaching the bonding layers, while also improving thermal conductivity and centering of the edge ring.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the bonding layer is exposed to radicals and heat transmitting gases during plasma processing, then the plasma processing can proceed, but the bonding layer deteriorates and peels

Engineering Contradiction:
Improveplasma processing capabilityVSAvoidbonding layer integrity
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The patent divides the protective function into multiple sealing members positioned at different locations (first sealing member between the edge ring and electrostatic chuck, second sealing member between the edge ring and base). This segmentation allows each sealing member to specifically protect different bonding layers, preventing radical and gas exposure while maintaining plasma processing capability.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The sealing members act as intermediary elements between the plasma environment and the bonding layers. These sealing members create a protective barrier that mediates the interaction between radicals/heat transmitting gases and the bonding layers, allowing plasma processing to proceed while preventing deterioration of the bonding layers.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If sealing members are added to protect bonding layers, then bonding layer integrity is improved, but device complexity increases

Engineering Contradiction:
Improvebonding layer protectionVSAvoidstage structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The sealing members serve multiple functions simultaneously: they seal gaps to protect bonding layers from radicals and gases, provides thermal conduction paths for heat transmission, and help maintain the structural integrity of the stage assembly. This multi-functionality reduces the need for additional separate components.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The sealing members are made of materials with properties similar to the surrounding components (edge ring, electrostatic chuck, base), creating a homogeneous structure that integrates seamlessly into the existing stage design. This material homogeneity allows the sealing function to be added without significantly increasing structural complexity.

Inventive Principle:
Principle #33Homogeneity

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively prevents deterioration of the bonding layers, reduces maintenance costs, and enhances the longevity of the electrostatic chucks by maintaining the integrity of the bonding layers and improving thermal uniformity and conductivity.

Implementation Method 1

a sealing member configured to protect the first bonding layer and the second bonding layer

Methodology Applied
Scientific EffectSealing:

Implementation Method 2

improving thermal conductivity and centering of the edge ring

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11521837B2Stage and substrate processing apparatus
Publication Date: 2022.12.06 TOKYO ELECTRON LTD
  • US11521837B2 patent drawing
  • US11521837B2 patent drawing
  • US11521837B2 patent drawing

AI summary

There is provision of a stage including a base; a substrate mount section provided above an upper surface of the base; an annular member mount section provided above the upper surface of the base, so as to surround a periphery of the substrate mount section; a first bonding layer bonding the base and the substrate mount section; a second bonding layer bonding the base and the annular member mount section; an annular member disposed on the annular member mount section; and a sealing member configured to protect the first bonding layer and the second bonding layer.