Electrostatic Chuck Wiring Layout for Via Alignment Reliability
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Solution Overview
Problem
The connection reliability of the wiring in electrostatic chucks is compromised due to positional deviations of vias in the passing portion of the adsorption electrode, leading to resistance failures or disconnections, primarily caused by differences in thermal shrinkage between green sheets during firing.
Innovation Solution
The design includes a ceramic plate with a built-in adsorption electrode and a ground electrode, featuring a wiring structure with connection pads and vias that maintain alignment through the adsorption electrode, using connection pads at the same height as the adsorption electrode to stabilize via connections, and extending to the ceramic plate surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If vias are formed to penetrate through the adsorption electrode in the wiring structure, then electrical connection between ground electrode and adsorption surface is achieved, but positional deviation of vias occurs due to thermal shrinkage difference, leading to reduced connection reliability
Solution Approach 1:
The patent introduces a ground electrode as an intermediary element disposed between the adsorption electrode and the opposite surface. The wiring structure connects the ground electrode to the adsorption surface through vias that do not need to penetrate the entire adsorption electrode thickness, thereby reducing positional deviation issues while maintaining electrical connection functionality.
Solution Approach 2:
The wiring path is segmented into multiple sections: connection pads on the adsorption electrode, vias connecting to the ground electrode, and additional connection elements. This segmentation allows each via to be formed in smaller, more controllable steps, improving positioning precision and reducing cumulative thermal shrinkage effects.
2Ease of manufacture
If green sheets are laminated and fired to form the ceramic plate with adsorption electrode, then the electrostatic chuck structure is created, but difference in thermal shrinkage between green sheets causes via positional deviation
Solution Approach 1:
The ground electrode is disposed and positioned in advance during the green sheet lamination process, before firing occurs. This preliminary positioning establishes a stable reference point that compensates for subsequent thermal shrinkage, ensuring that via positions remain accurate after the firing process completes the ceramic plate formation.
3Reliability
If vias are formed to connect wiring through the adsorption electrode, then electrical pathway is established, but contact area of via becomes smaller due to positional deviation, causing resistance failure or disconnection
Solution Approach 1:
The patent applies different structural qualities to different regions: the ground electrode is disposed in a specific location between the adsorption electrode and opposite surface, and connection pads are strategically positioned on the adsorption electrode. This local optimization ensures that via connections occur in regions with adequate contact area, preventing resistance failures while maintaining the overall wiring functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the connection reliability of the wiring by preventing hindered connections and ensuring stable electrical pathways, facilitating easy detachment of substrates and maintaining electrostatic force integrity.
Implementation Method 1
adsorbs the substrate to the electrostatic chuck using an electrostatic force by applying a voltage to the adsorption electrode built in the ceramic plate
Implementation Method 2
a wiring and a ground electrode for allowing electric charges to escape from the adsorption surface to the ground potential are formed inside the ceramic plate
Data Source
AI summary
An electrostatic chuck includes a ceramic plate, an adsorption electrode, a ground electrode, and a wiring. The adsorption electrode is built-in below one surface of the ceramic plate. The ground electrode is disposed between another surface of the ceramic plate and the adsorption electrode in the ceramic plate and connectable to a ground potential. The wiring is connected to the ground electrode in the ceramic plate and extending through the adsorption electrode to the one surface of the ceramic plate. The wiring includes a connection pad disposed at a same height position as the adsorption electrode, a first via connecting the connection pad and the ground electrode or another connection pad disposed closer to the ground electrode than the connection pad, and a second via connecting the connection pad and the one surface of the ceramic plate.