Electrostatic Chuck Via Design for Heat Uniformity

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Solution Overview

Problem

Existing electrostatic chucks face limitations in achieving high heat uniformity due to restrictions in arranging heater electrodes, leading to temperature gradients across the adsorption face.

Innovation Solution

A substrate fixing device with an electrostatic chuck featuring two heating layers and vias that electrically connect the electrodes, where the via's end portion is larger in diameter than the body portion, enhancing the degree of freedom in arranging the heater electrodes and improving heat uniformity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If a single heater electrode is used in the electrostatic chuck, then the device complexity is reduced, but heat uniformity across the adsorption face deteriorates due to temperature gradients

Engineering Contradiction:
Improveheater electrode structureVSAvoidheat uniformity
Core Design Contradiction:
Device complexityVSTemperature

Solution Approach 1:

The heater electrode is divided into multiple segments arranged in a specific pattern (e.g., concentric circles or radial lines) across the adsorption face. Each segment can be independently controlled to compensate for temperature gradients and achieve uniform heating across the entire surface.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the heater electrode are designed with different heating characteristics. For example, the center region may have different heating power or pattern compared to the edge regions, allowing each local area to be optimized for its specific thermal requirements to achieve overall uniformity.

Inventive Principle:
Principle #3Local quality

2Temperature

If the heater electrode area is increased to improve heat uniformity, then heat uniformity improves, but the degree of freedom for arranging the electrode is reduced due to power feeding portion constraints

Engineering Contradiction:
Improveheat uniformityVSAvoidarrangement flexibility
Core Design Contradiction:
TemperatureVSAdaptability or versatility

Solution Approach 1:

The heater electrode arrangement transitions from a two-dimensional planar layout to a three-dimensional structure by adding vertical layering. Multiple heater layers are stacked at different heights, allowing power feeding portions to be routed through vertical vias and reducing constraints on the horizontal arrangement flexibility.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

Multiple heater electrodes are nested within each other in a layered configuration, with inner heaters positioned within the coverage area of outer heaters. This nested arrangement allows efficient use of space and enables flexible power feeding routes through the layered structure.

Inventive Principle:
Principle #7Nested doll (Nesting)

3Temperature

If multiple heating layers are added to improve heat uniformity, then heat uniformity improves, but device complexity increases

Engineering Contradiction:
Improveheat uniformityVSAvoidheating layer structure
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The multiple heating layers serve multiple functions simultaneously: they provide uniform heat distribution, enable flexible power feeding routes through vertical connections, and create a compact layered structure. The via structures also serve dual purposes of electrical connection and mechanical support.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

Multiple heating layers are combined into a single integrated electrostatic chuck structure, with shared support elements and coordinated control systems. The layers work together as a unified thermal management system rather than separate independent components.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The configuration allows for high heat uniformity across the adsorption face, improving temperature regulation and connection reliability between the heating layers.

Implementation Method 1

a first heating layer that is formed on the adsorption layer and that includes a first electrode configured to generate heat; a second heating layer that is formed on the first heating layer and that includes a second electrode configured to generate heat

Methodology Applied
Scientific EffectJoule heating: Joule Heating

Implementation Method 2

When a voltage is applied to the electrode built in the ceramic plate, the wafer is adsorbed to the electrostatic chuck by use of electrostatic force

Methodology Applied
Scientific EffectElectrostatic force: Electrostatics

Data Source

PatentUS11699612B2Substrate fixing device, electrostatic chuck and electrostatic chuck manufacturing method
Publication Date: 2023.07.11 SHINKO ELECTRIC IND CO LTD
  • US11699612B2 patent drawing
  • US11699612B2 patent drawing
  • US11699612B2 patent drawing

AI summary

A substrate fixing device includes: a base plate; and an electrostatic chuck that is fixed to the base plate to adsorb a substrate by electrostatic force. The electrostatic chuck includes: an adsorption layer that is formed of ceramic and that contacts the substrate to adsorb and hold the substrate; a first heating layer that is formed on the adsorption layer and that includes a first electrode; a second heating layer that is formed on the first heating layer and that includes a second electrode; and a via that is provided between the first electrode and the second electrode to electrically connect the first electrode and the second electrode to each other. The via includes a body portion, and an end portion that is connected to the body portion. A diameter of the end portion is larger than that of the body portion.