Electrostatic Chuck Voltage Monitoring for Wafer Process Interlocks

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Solution Overview

Problem

The existing semiconductor processing systems face inefficiencies due to frequent stoppages and increased costs caused by the need to periodically inspect and replace damaged electrostatic chucks, which affects the quality and yield of semiconductor wafer processing.

Innovation Solution

A semiconductor processing system that monitors the electrostatic chuck's condition in real-time by measuring voltage changes and outputs an interlock control signal to stop the operation when a predetermined voltage range is reached, allowing for timely replacement without halting the manufacturing process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the electrostatic chuck is periodically inspected using a separate stage, then the deterioration of the electrostatic chuck can be detected, but the manufacturing time increases and the cost increases

Engineering Contradiction:

Improvedetection of electrostatic chuck deteriorationVSAvoidmanufacturing time

Core Design Contradiction:

ReliabilityVSLoss of time

Solution Approach 1:

The patent replaces the mechanical inspection system (separate stage with jig) with an electrical monitoring system. A voltage measuring device continuously monitors the voltage across the electrostatic chuck during normal operation, detecting deterioration through voltage changes without requiring mechanical intervention or stopping the manufacturing process.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent enables continuous monitoring of the electrostatic chuck voltage during the entire manufacturing process. The voltage measuring device operates continuously without interrupting the manufacturing workflow, allowing detection of chuck deterioration while maintaining uninterrupted production flow.

Inventive Principle:

Principle #20Continuity of useful action

2Manufacturing precision

If the electrostatic chuck is periodically replaced, then the quality of semiconductor wafer processing is maintained, but the productivity decreases

Engineering Contradiction:

Improvequality of semiconductor wafer processingVSAvoidproductivity of semiconductor manufacturing

Core Design Contradiction:

Manufacturing precisionVSProductivity

Solution Approach 1:

The patent implements a feedback mechanism where the voltage measuring device continuously monitors the electrostatic chuck condition and provides real-time data to a control device. When the voltage indicates deterioration beyond a threshold, the system automatically triggers an alert or stops operation, ensuring quality maintenance while avoiding premature or unnecessary replacements that would reduce productivity.

Inventive Principle:

Principle #23Feedback

Solution Approach 2:

The patent performs preliminary detection of electrostatic chuck deterioration by continuously monitoring voltage during operation. This allows the system to identify when replacement is needed before actual defects occur in wafer processing, enabling planned maintenance that minimizes production disruption and maintains quality standards.

Inventive Principle:

Principle #10Preliminary action

3Reliability

If a separate stage with jig is used to inspect the electrostatic chuck, then the deterioration can be determined, but the device complexity increases

Engineering Contradiction:

Improvedetermination of electrostatic chuck stateVSAvoidcomplexity of inspection system

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent extracts the inspection function from a separate mechanical stage and integrates it directly into the existing electrostatic chuck system. The voltage measuring device is incorporated into the chuck's electrical circuitry, eliminating the need for external jigs and separate inspection stages, thereby reducing overall system complexity while maintaining detection reliability.

Inventive Principle:

Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach minimizes stoppages and increases the yield of semiconductor processing by enabling real-time monitoring and replacement of the electrostatic chuck, thus maintaining continuous operation and improving manufacturing efficiency.

Implementation Method 1

a voltage measuring device for measuring a voltage corresponding to the first RF power to output a digital signal

Methodology Applied

Scientific EffectVoltage measurement: Ohm's Law

Data Source

PatentUS12125687B2System of semiconductor process and control method thereof

Publication Date: 2024.10.22 SAMSUNG ELECTRONICS CO LTD

AI summary

A semiconductor processing system includes: a semiconductor processing chamber including an electrostatic chuck disposed in a chamber housing, and a first power supplier for supplying first radio frequency (RF) power to an internal electrode disposed in the electrostatic chuck; a voltage measuring device for measuring a voltage corresponding to the first RF power to output a digital signal; and a control device for outputting an interlock control signal to the semiconductor processing chamber, when it is determined that the voltage increases to be within a predetermined reference range based on the digital signal. The electrostatic chuck is configured to enable a wafer to be seated on a surface of the electrostatic chuck.