Electrostatic Adsorption Member Structure to Prevent Porous Body Detachment

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Solution Overview

Problem

Abnormal electrical discharge occurs in substrate fixing devices equipped with porous bodies, which can detach due to adhesive deterioration or reduced adhesion over time, leading to ineffective substrate treatment.

Innovation Solution

An electrostatic adsorption member with a dielectric member and porous bodies having specific through-hole and opening configurations, where the porous bodies are designed to maintain adhesion even with reduced adhesion, preventing detachment and suppressing abnormal electrical discharge.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a porous body is provided in the through-hole to suppress abnormal electrical discharge, then abnormal electrical discharge is suppressed, but the porous body may detach due to adhesive deterioration or reduced adhesion over time

Engineering Contradiction:
Improvesuppression of abnormal electrical dischargeVSAvoidadhesion of porous body to through-hole
Core Design Contradiction:
ReliabilityVSStability of the object's composition

Solution Approach 1:

The through-hole is divided into multiple sections with different opening sizes (first opening and second opening at different distances from the first surface). The porous body is correspondingly segmented into portions that fit within different opening sections, creating a multi-level anchoring structure that prevents detachment while maintaining electrical discharge suppression functionality.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The porous body is nested within the through-hole structure with specific portions positioned at different depths. The first portion is located inside the first opening while the second portion extends outside, creating a nested configuration where the porous body is anchored at multiple levels within the dielectric member structure, preventing detachment.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Strength

If the porous body is bonded to the through-hole wall by adhesive, then the porous body is fixed, but the adhesive deteriorates due to repeated plasma irradiation, leading to detachment

Engineering Contradiction:
Improvebonding strength between porous body and through-holeVSAvoidservice life of adhesive under plasma irradiation
Core Design Contradiction:
StrengthVSDuration of action of stationary object

Solution Approach 1:

The through-hole geometry is designed in advance with specific opening configurations (first opening and second opening at different distances) that create mechanical anchoring features. The porous body is designed with corresponding portions (first portion inside first opening, second portion outside) that utilize these pre-designed geometric features for mechanical interlocking, reducing reliance on adhesive durability under plasma irradiation.

Inventive Principle:
Principle #10Preliminary action

3Stability of the object's composition

If the porous body is embedded deeply in the through-hole to prevent detachment, then adhesion is improved, but the structure becomes more complex and manufacturing difficulty increases

Engineering Contradiction:
Improveprevention of porous body detachmentVSAvoidcomplexity of through-hole and porous body structure
Core Design Contradiction:
Stability of the object's compositionVSDevice complexity

Solution Approach 1:

The through-hole structure exhibits local quality variations with different opening sizes at different locations (first opening at first distance, second opening at second distance). The porous body correspondingly has different portions (first portion inside first opening, second portion outside first opening) that match these local structural characteristics, creating effective anchoring without requiring uniform deep embedding throughout the entire structure.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively suppresses detachment of porous bodies from through-holes, thereby reducing abnormal electrical discharge and ensuring reliable substrate treatment by maintaining strong bonding between the porous bodies and dielectric members.

Implementation Method 1

an electrostatic adsorption member is formed with a through-hole for a cooling gas for cooling a substrate and a porous body for suppressing abnormal electrical discharge is provided in the through-hole

Methodology Applied
Scientific EffectElectrostatic adsorption: Electrostatics

Implementation Method 2

a through-hole for a cooling gas for cooling a substrate

Methodology Applied
Scientific EffectConvection cooling: Convection

Implementation Method 3

a through-hole for a cooling gas for cooling a substrate

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11881794B2Electrostatic adsorption member and substrate fixing device
Publication Date: 2024.01.23 SHINKO ELECTRIC IND CO LTD
  • US11881794B2 patent drawing
  • US11881794B2 patent drawing
  • US11881794B2 patent drawing

AI summary

An electrostatic adsorption member includes a dielectric member having a first surface and a second surface opposite to the first surface and formed with a through-hole penetrating from the first surface to the second surface, and a porous body provided in the through-hole and having a third surface flush with the first surface. The through-hole has a first opening apart from the first surface by a first distance in a first direction perpendicular to the first surface, and a second opening apart from the first surface by a second distance larger than the first distance in the first direction. In a plan view from the first direction, at least a portion of the first opening is inside the second opening, and the porous body has a first portion located inside the first opening, and a second portion connected to the first portion and located outside the first opening.