Electrostatic Clamped Spinning Disk for Low-Angle-Spread Ion Implantation
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Solution Overview
Problem
Conventional high energy implantation systems for semiconductor devices face issues with non-uniform angular spread due to electrostatic scanning, which affects the precision of deep implanted regions in devices like insulated gate bipolar transistors (IGBTs).
Innovation Solution
A semiconductor processing system utilizing a spinning disk with a central hub and radially extending spokes, where workpieces are electrostatically clamped to platens that can rotate, allowing for variable angle implants and horizontal mounting, enabling precise high energy ion implantation with reduced angular spread.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If electrostatic scanning is used to create a ribbon ion beam, then high energy implantation is achieved, but non-uniformities in angular spread are exacerbated
Solution Approach 1:
The patent removes the electrostatic scanning component from the ion beam delivery system. Instead of using electrostatic scanning to create a ribbon beam, the system uses a focused spot beam that is mechanically scanned across the workpiece surface by rotating the wafer holder, thereby eliminating the angular spread non-uniformities caused by electrostatic scanning while maintaining high energy implantation capability
Solution Approach 2:
The patent replaces the electrostatic scanning system with a mechanical scanning system. The ion beam is focused to a spot and then mechanically scanned across the workpiece by rotating the wafer holder at controlled speeds, substituting electromagnetic scanning with mechanical rotation to achieve uniform angular spread
2Ease of operation
If conventional implantation systems are used, then processing is performed, but workpieces cannot be mounted in horizontal orientation and variable angle implants are limited
Solution Approach 1:
The patent employs a dynamically adjustable system where the wafer holder can be tilted to various angles relative to the ion beam axis. The holder rotates about a vertical axis and can be positioned at different tilt angles, allowing both horizontal mounting for standard implants and variable angle configurations for specialized implantation requirements, thereby achieving both ease of operation and adaptability
Solution Approach 2:
The wafer holder design provides multi-functionality by combining horizontal rotation with angular tilting capability. A single holder structure can perform standard horizontal implants, variable angle implants, and accommodate different workpiece orientations, eliminating the need for separate specialized equipment and improving both operational ease and versatility
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves precise high energy ion implantation with low angular spread, allowing for improved processing of multiple workpieces with enhanced precision and efficiency, addressing the limitations of existing technologies.
Implementation Method 1
workpieces are electrostatically clamped to the platens
Implementation Method 2
A semiconductor processing system produces a spot ion beam, which is directed to a plurality of workpieces
Data Source
AI summary
A system comprising a spinning disk is disclosed. The system comprises a semiconductor processing system, such as a high energy implantation system. The semiconductor processing system produces a spot ion beam, which is directed to a plurality of workpieces, which are disposed on the spinning disk. The spinning disk comprises a rotating central hub with a plurality of platens. The plurality of platens may extend outward from the central hub and workpieces are electrostatically clamped to the platens. The plurality of platens may also be capable of rotation. The central hub also controls the rotation of each of the platens about an axis orthogonal to the rotation axis of the central hub. In this way, variable angle implants may be performed. Additionally, this allows the workpieces to be mounted while in a horizontal orientation.