Electrostatic Transfer Apparatus for Semiconductor Elements
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Solution Overview
Problem
The integration of semiconductor elements like micro-LEDs and micro-lasers is hindered by the strict lattice matching requirements with substrates, leading to limited substrate size and incompatibility with driver ICs, which affects their properties and integration.
Innovation Solution
A transfer apparatus with a transfer substrate and arrayed gripping members, each comprising gripping arms and legs that switch between gripping and released positions, allows for precise transfer of target elements from an original substrate to a receiving substrate with minimal damage, using electrostatic forces for gripping and releasing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If semiconductor elements are grown on single-crystal substrates with strict lattice matching requirements, then the properties of semiconductor materials are maintained, but the substrate size is limited and integration with driver ICs is affected
Solution Approach 1:
The invention segments the substrate system into two independent parts: the growth substrate (providing lattice matching) and the transfer substrate (providing compatibility with driver ICs). The semiconductor elements are grown on the growth substrate, then transferred to the transfer substrate, allowing each substrate to fulfill its specific function without compromise
Solution Approach 2:
The invention introduces a transfer substrate as an intermediary between the growth substrate and the final application. This intermediary allows semiconductor elements to be grown under ideal conditions on the growth substrate, then moved to the transfer substrate which can be integrated with driver ICs, resolving the conflict between material quality and system compatibility
2Ease of manufacture
If conventional transfer methods are used for semiconductor elements, then transfer process is simple, but damage to target elements occurs during transfer
Solution Approach 1:
The invention replaces conventional mechanical transfer methods with an electrostatic field-based transfer system. The transfer apparatus uses electrostatic attraction to pick up and place semiconductor elements, eliminating mechanical contact that causes damage while maintaining process simplicity through field-based control
Solution Approach 2:
The invention changes the transfer mechanism from mechanical force to electrostatic force by controlling electric field parameters. By adjusting voltage and electrostatic field strength, the system can gently manipulate semiconductor elements during transfer, preserving element integrity while keeping the process straightforward through electrical control
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the transfer printing of semiconductor elements with strong gripping ability and minimal damage, facilitating the integration of these elements onto various substrates, including those with driver ICs, while maintaining their properties.
Implementation Method 1
using electrostatic forces for gripping and releasing
Implementation Method 2
using electrostatic forces for gripping and releasing
Data Source
AI summary
A transfer apparatus and a transfer method are provided. The transfer apparatus includes a transfer substrate; and a plurality of gripping members arranged in an array and disposed on the transfer substrate. Each gripping member includes at least two gripping arms each of which has a first end disposed on the transfer substrate, and gripping legs connected with second ends of the gripping arms and configured to switch between a gripping position and a released position.