Electrostatic Withstand Voltage Test Device Pin Segmentation
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Solution Overview
Problem
Conventional electrostatic withstand voltage testing methods fail to accurately measure the electrostatic withstand voltage of semiconductor devices due to the risk of large current discharge through multiple pins, leading to potential device failure.
Innovation Solution
An electrostatic withstand voltage test device and method that includes a metal plate, a power supply, an insulator, a switch circuit, and a controller to accurately measure the electrostatic withstand voltage of semiconductor devices on a mount board by simulating an electrostatic discharge through multiple pins.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If an electrostatic discharge is caused through one pin, then the device complexity is reduced, but the measurement precision of electrostatic withstand voltage is insufficient
Solution Approach 1:
The invention divides the electrostatic discharge test into multiple independent discharge paths, each controlled by a separate switch circuit. Instead of discharging through a single pin, the test can apply electrostatic discharge through multiple pins simultaneously or individually, allowing accurate measurement of withstand voltage while controlling current distribution through segmented control of discharge paths.
Solution Approach 2:
The invention introduces a switch circuit as an intermediary component between the electrostatic discharge source and the semiconductor device pins. This switch circuit enables controlled connection and disconnection of multiple discharge paths, allowing precise control over which pins receive discharge and how current is distributed, thereby improving measurement accuracy without excessive complexity.
2Measurement precision
If an electrostatic discharge is caused through multiple pins, then the measurement precision of electrostatic withstand voltage is improved, but the object-affected harmful factors increase due to large current
Solution Approach 1:
By segmenting the electrostatic discharge into multiple controlled paths through individual switch circuits for each pin, the invention distributes the total current across multiple paths. This segmentation prevents excessive current concentration at any single point, reducing the risk of current-induced damage while maintaining the ability to measure withstand voltage accurately through multi-pin discharge.
Solution Approach 2:
The invention applies partial electrostatic discharge action by allowing selective activation of individual pins or groups of pins through the switch circuit. Instead of forcing full discharge through all pins simultaneously, the system can apply discharge to specific pins based on test requirements, reducing harmful current effects while maintaining measurement capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables accurate measurement of the electrostatic withstand voltage of semiconductor devices, reducing the risk of device failure and ensuring reliable electrostatic discharge testing in manufacturing fields.
Implementation Method 1
a power supply to apply a voltage to the metal plate
Implementation Method 2
discharging an electric charge stored in the conductor pattern to ground wiring through the semiconductor device
Data Source
AI summary
A mount board has a plurality of terminals electrically connected to a plurality of pins of a semiconductor device, and a conductor pattern. An electrostatic withstand voltage test device includes a metal plate on which the mount board is installed, a power supply for applying a voltage to the metal plate, an insulator disposed between the metal plate and the mount board, a switch circuit connected between the terminals and ground wiring, and a controller for controlling the switch circuit. The switch circuit includes a plurality of first switches provided corresponding to the terminals and each connecting a corresponding terminal to the ground wiring. The controller turns on at least one first switch selected from the first switches when an electric charge stored in the conductor pattern is discharged to the ground wiring through the semiconductor device.