Elevated Coolant Thermal Management for Data Centers

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Solution Overview

Problem

Current data center thermal management systems require high energy usage and low efficiency due to the need for refrigeration cycles to chill coolants below ambient temperature, which is inefficient and costly as it violates thermodynamic principles.

Innovation Solution

A data center cooling system with a flow management system that maintains high coolant temperatures above ambient, eliminating the need for refrigeration cycles and enabling waste heat recovery processes, thereby reducing energy usage and improving efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If refrigeration cycles are used to chill coolant below ambient temperature, then the coolant can remove waste heat from electronic devices, but energy usage increases and efficiency decreases

Engineering Contradiction:
Improvecoolant temperatureVSAvoidenergy usage
Core Design Contradiction:
TemperatureVSUse of energy by moving object

Solution Approach 1:

Instead of cooling the coolant below ambient temperature using energy-intensive refrigeration cycles, the patent inverts the approach by allowing the coolant to operate above ambient temperature. The system uses ambient air as the cooling medium, eliminating the need for refrigeration and significantly reducing energy consumption while maintaining effective heat removal from electronic devices.

Inventive Principle:
Principle #13The other way round (Inversion)

2Temperature

If refrigeration cycles are used to chill coolant below ambient temperature, then the coolant can remove waste heat from electronic devices, but the process becomes less efficient

Engineering Contradiction:
Improvecoolant temperatureVSAvoidefficiency
Core Design Contradiction:
TemperatureVSLoss of energy

Solution Approach 1:

The patent eliminates the thermodynamic inefficiencies of refrigeration cycles by inverting the temperature relationship. The coolant operates above ambient temperature, using the natural temperature difference between the heated coolant and ambient air for heat rejection, thereby avoiding the energy losses inherent in sub-ambient cooling systems.

Inventive Principle:
Principle #13The other way round (Inversion)

Solution Approach 2:

The patent converts the typically wasted ambient heat into a useful resource. By allowing the coolant to operate above ambient temperature, the system can reject heat directly to the ambient environment without requiring additional cooling, effectively using the ambient air as a free heat sink and improving overall system efficiency.

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

3Temperature

If coolant temperature is reduced below ambient, then waste heat can be removed from electronics, but waste heat recovery potential is reduced

Engineering Contradiction:
Improvecoolant temperatureVSAvoidwaste heat recovery potential
Core Design Contradiction:
TemperatureVSLoss of energy

Solution Approach 1:

The patent inverts the traditional approach by operating the coolant above ambient temperature rather than below it. This inversion preserves the thermal energy in the coolant, maintaining its usefulness for waste heat recovery applications while still achieving effective cooling of electronic devices through direct heat rejection to ambient air.

Inventive Principle:
Principle #13The other way round (Inversion)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The system achieves low energy usage and high efficiency by sustaining elevated coolant temperatures, allowing for reduced fan power requirements and enabling additional waste heat recovery processes, thus enhancing global sustainability.

Implementation Method 1

a first coolant in a first cooling loop to remove heat created by the at least one heat-generating electronic device

Methodology Applied
Scientific EffectHeat conduction: Conduction (thermal)

Implementation Method 2

a first heat exchanger interface to transfer heat out of the first coolant

Methodology Applied
Scientific EffectConvection: Convection

Data Source

PatentUS12289871B2High temperature electronic device thermal management system
Publication Date: 2025.04.29 JETCOOL TECHNOLOGIES INC
  • US12289871B2 patent drawing
  • US12289871B2 patent drawing
  • US12289871B2 patent drawing

AI summary

A high temperature electronic device thermal management system. Data centers contain many large racks of computer servers with electronic devices that generate heat. For the devices to function properly, they must not exceed a maximum temperature. Typical techniques for thermal management of data center electronics involve using sub-ambient temperature coolants via refrigeration cycles, requiring significant input energy to operate. The present thermal management system includes a flow management system to produce elevated coolant temperatures while sustaining safe device temperatures. This allows the coolant to reject to ambient temperatures globally and year-round, enabling reduced energy usage by no longer requiring refrigeration cycles. Further, operation at or above 55° C. would allow for implementation of additional waste heat recovery processes with increased energy efficiency.