Elliptical Jig for Uniform Wafer Device Spacing
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Solution Overview
Problem
The existing wafer expanding methods result in non-uniform spacing between adjacent devices due to the difference in the number of exposed adhesive tape portions along the shorter and longer sides of rectangular devices, leading to uneven spacing during the division process.
Innovation Solution
A wafer expanding method and apparatus that utilizes an elliptical annular jig to restrict the width of the adhesive tape exposed portion differently along the shorter and longer sides, ensuring equal spacing between devices by attaching the tape to specific portions of the jig during expansion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the wafer is expanded uniformly in both directions, then the expansion process is simple, but the spacing between adjacent devices becomes non-uniform
Solution Approach 1:
The patent applies asymmetry by using an annular jig with different widths in the first and second directions. The jig has a first width in the direction where shorter sides of devices extend and a second width in the direction where longer sides extend, creating an asymmetric expansion structure that compensates for the asymmetric exposure of adhesive tape, thereby achieving uniform device spacing after expansion
2Manufacturing precision
If the adhesive tape is expanded more in the direction with fewer devices, then uniform spacing is achieved, but the expansion process becomes complex
Solution Approach 1:
The patent introduces an annular jig as an intermediary tool between the wafer and the expansion mechanism. This jig serves as a mediator that automatically controls the differential expansion in different directions through its asymmetric geometry, eliminating the need for complex control systems while achieving uniform device spacing
Data Source
AI summary
A wafer expanding method for expanding a wafer having a plurality of rectangular devices respectively formed in a plurality of separate regions defined by a plurality of division lines, thereby increasing spacing between any adjacent ones of the devices, each rectangular device having a pair of shorter sides and a pair of longer sides. The wafer expanding method includes a jig preparing step of preparing an annular jig having an elliptical opening, the elliptical opening having a shorter portion for restricting a width of the annular exposed portion in a first direction where the shorter sides of the devices extend to a first width and a longer portion for restricting the width of the annular exposed portion in a second direction where the longer sides of the devices extend to a second width larger than the first width.