Elliptical Redistribution Patterns for Reliable Fan-Out Packaging
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Solution Overview
Problem
Ensuring the reliability of integrated fan-out semiconductor packages, which face challenges due to increased complexity and miniaturization, requiring innovative solutions to maintain performance and durability.
Innovation Solution
The manufacturing process involves a redistribution structure with specifically designed conductive patterns and vias, including a dual damascene process for forming conductive patterns and vias, and a de-bonding layer for carrier separation, along with underfill and encapsulant formation to enhance structural integrity and connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the minimum feature size is reduced to increase integration density, then more electronic components can be integrated into a given area, but the reliability of the semiconductor package deteriorates due to increased complexity and miniaturization
Solution Approach 1:
The patent divides the conductive pattern into multiple segments (first conductive pattern, second conductive pattern, third conductive pattern) arranged in a stepped configuration. This segmentation allows each segment to be optimized independently for connectivity while distributing stress across multiple interfaces, thereby maintaining reliability despite miniaturization.
Solution Approach 2:
The patent transitions from a planar conductive pattern to a three-dimensional stepped structure by adding vertical layering. The conductive patterns are arranged at different heights with intermediate structures connecting them, creating a multi-level interconnection architecture that improves connectivity without increasing footprint area, thus supporting higher integration density while maintaining signal integrity and mechanical reliability.
2Area of stationary object
If the package size is reduced to achieve compactness, then the integrated fan-out package becomes more compact, but stress concentration increases leading to reduced reliability
Solution Approach 1:
The patent introduces curved transition structures between the conductive patterns at different levels. The intermediate conductive structures feature curved surfaces that smoothly connect the upper and lower conductive patterns, distributing mechanical stress along the curved path rather than concentrating it at sharp corners or abrupt transitions. This curvature design maintains compact packaging while reducing stress concentration points.
Solution Approach 2:
The patent employs a composite structure consisting of multiple conductive materials and dielectric materials in a layered configuration. The intermediate conductive structures serve as transition zones with different material properties that gradually bridge the mechanical and electrical properties between upper and lower conductive layers, distributing stress across the composite structure rather than concentrating it at single interfaces.
3Ease of manufacture
If conventional conductive patterns are used in miniaturized packages, then manufacturing is simpler, but connectivity and stress distribution are insufficient leading to poor reliability
Solution Approach 1:
The patent incorporates intermediate conductive structures and de-bonding layers during the early stages of package manufacturing, before final assembly. The de-bonding layer is pre-formed to enable controlled separation of the carrier substrate, while intermediate conductive structures are pre-configured to establish stress distribution pathways. These preliminary actions ensure that connectivity and stress management are built into the structure from the outset, improving reliability without complicating the overall manufacturing flow.
Data Source
AI summary
A semiconductor package includes a die, a redistribution structure and a plurality of conductive terminals. The redistribution structure is disposed below and electrically connected to the die. The redistribution structure includes a plurality of conductive patterns, and at least one of the plurality of conductive patterns has a cross-section substantially parallel to the surface of the die. The cross-section has a long-axis and a short-axis, and the long-axis intersects with a center axis of the die. The conductive terminals are disposed below and electrically connected to the redistribution structure.