Elongated Pillar Bumps for Semiconductor Package Thermal Management
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Solution Overview
Problem
High-density flip chip semiconductor packages face thermal electrical issues such as heat dissipation, cross talk, and signal propagation delays due to increased input/output connections, which affect reliability and quality.
Innovation Solution
The use of elongated rounded conductive pillar bumps that extend along conductive traces on the substrate, providing improved routing space and reduced stress, along with a metal pad design featuring unique shapes and orientations for enhanced electrical coupling and mechanical strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the amount of input/output connections is increased to achieve high-density multi-functional packaging, then the functionality and pin count are improved, but thermal electrical problems such as heat dissipation, cross talk, and signal propagation delay worsen
Solution Approach 1:
The patent applies local quality by varying the spacing between conductive pillar bumps in different regions of the substrate. Specifically, greater spacing is provided between adjacent conductive pillar bumps in regions where thermal electrical problems are more severe, while maintaining closer spacing in regions where it does not adversely affect signal integrity. This localized adjustment optimizes heat dissipation and reduces cross talk in critical areas without compromising the overall high-density connectivity of the package.
2Object-affected harmful factors
If the spacing between conductive pillar bumps is increased to reduce thermal electrical issues, then heat dissipation and cross talk are improved, but the density of interconnection is reduced
Solution Approach 1:
The patent implements local quality by applying different spacing configurations to different regions of the substrate based on their specific functional requirements and thermal electrical characteristics. High-density regions maintain closer bump spacing for maximum interconnection, while regions prone to cross talk or heat accumulation use increased spacing. This regional differentiation allows the package to achieve both high overall interconnection density and effective mitigation of thermal electrical problems in critical areas.
Data Source
AI summary
A semiconductor package is provided. In one configuration, the semiconductor package includes a substrate having a die attach surface. A conductive trace is disposed on the substrate, wherein the conductive trace is elongated and carries a signal or a ground across at least a portion of the substrate. A die is mounted on the die attach surface of the substrate via a conductive pillar bump, the conductive pillar bump being rounded and elongated such that the conductive pillar bump extends along a length of the conductive trace and contacts the conductive trace at an end or at an intermediate portion thereof. The die further includes a metal pad electrically coupling to the conductive pillar bump, wherein the metal pad has a first edge and a second edge substantially vertical to the first edge, and wherein the first edge is not adjacent to the second edge.