Semiconductor/Solid-State Device Details TRIZ Cases

An interposer substrate links microprocessor and memory chips using fine-pitch lines and through electrodes to boost signal integration density.

A power semiconductor module uses hollow cylindrical metallic die-cast parts injection-molded into the housing to join cooling components and external power lines.

Hydrogen anneal seals openings in the package cover layer, eliminating complex flip-chip alignment equipment while maintaining hermetic integrity.

Variable frequency microwave curing densifies polyimide films at low temperatures.

Low-conductivity thermal pads block heat transfer between stacked packages, reducing warpage and mechanical stress.

A pre-sintered semiconductor die structure uses local sinter connections to fix the die on a substrate before full thermal processing.

Segmenting the connection into rigid and flexible parts resolves structural stability versus adaptability, enhancing signal transmission in compact devices.

A light-emitting device uses a resin bonding member with specific nanoparticles to bond the element and cover its surfaces.

A PLCC LED package uses a multi-level leadframe configuration to dissipate heat from the die.

Sputtered shielding films connect to exposed metallic pillars, resolving popcorn effects from air bubbles in prior perforated shield designs.

Elongated rounded conductive pillar bumps extend along substrate traces to reduce thermal electrical issues like cross talk and heat dissipation delays.

A mask includes separated line patterns connected by a projecting connection pattern to secure margin during lithography.

A face-to-face wafer bonding method joins separate integrated circuit and antenna coil wafers to form compact contactless micromodules.

Segmenting substrates with an insulator layer resolves the conflict between optical isolation and transistor density while managing heat buildup.

Encapsulating redistribution layer edges prevents delamination and thermo-mechanical stress from coefficient of thermal expansion mismatches.

A non-contiguous multi-section conductive carrier merges heat spreaders and clips to reduce package volume while maintaining thermal protection.

A heat sink uses flexible heat pipes to thermally couple multiple components across varying surface heights.

Vertical via routing reduces package area and chip-to-chip distance for compact display devices.

Linear metal layer width optimizes bonding strength between insulating layers, preventing pad damage and apparatus contamination from plasma treatment.

A preformed isolation layer with a conductive ring prevents arcing while maintaining galvanic isolation between stacked IC dies.

Thin insulating resin members with conductive fillers seal lead frames, reducing device size while maintaining rigidity and preventing chipping.

Alternating material layers create vertical capacitance beneath CMOS devices, reducing chip area consumption and series resistance.

Replacing vacuum chambers with atmospheric liquid deposition eliminates material waste and mechanical damage while maintaining precise patterning control.

Two-die molding embeds touch sensor connections in plastic while allowing lead-out portions to protrude, eliminating housing recesses that trap material.

Segmented molding isolates the sensitive layer from outgassing while a dedicated heater circuit prevents thermal interference.

A multi-die power semiconductor device integrates MOSFETs and a control die onto a single lead frame unit with carrier pins.

Replacing wire bonds with PCB traces reduces parasitic losses in high frequency modules while lowering substrate complexity and fabrication expenses.

A leadframe dual-face package uses inner lead portions and bump electrodes for external connections.

A silicate phosphor with rare earth dopants emits high-intensity light at 480 to 540 nm wavelengths.

Selective passivation prevents undercut during etching, ensuring sufficient copper pillar support and improved flip-chip reliability.

An interposed coating layer segment joins metal posts to conductor pads, preventing solder resist peeling under external stress.

Strategic placement of a shielding vertical line between signal lines minimizes coupling effects while maintaining display aperture ratio.

A low dielectric constant buffer layer between the die and plastic encapsulation reduces capacitive coupling and power loss in high-frequency devices.

A semiconductor structure uses a single through via to electrically connect wafers directly.

An integrated processing chip isolates two processors to enable independent self-diagnosis, resolving redundancy complexity risks.

A terminal disposition portion embeds external connecting terminals with a level difference to curb resin flow into interfacial gaps.

Differentiated dummy pattern occupancy ratios in scribe regions prevent CMP dishing while minimizing conductive material accumulation that clogs dicing blades.

Molded thermally conductive polymer frames integrate with LED actuators, resolving thermal expansion and oxidation issues while simplifying manufacturing.

A power supply wiring structure uses extension wirings and interlayer vias to route current across different planes.

Temporary bonding fixes components before melting solder in a vacuum, eliminating multi-stage heating and reducing processing time.

Sheet mold compound carriers eliminate entrapped air voids by replacing fragile release films with disposable solid sheets.

Alternating doped epitaxial regions diffuse dopants into fins, resolving integration complexity while maintaining transistor density in shrinking device sizes.

Blind holes in a substrate are filled with conductive filler to form protruding solder bumps, eliminating interposer layers and reducing routing complexity.

Composite interposer with compliant dielectric layer minimizes silicon usage and production costs while resolving thermal expansion mismatch issues.

Dummy patterns in substrate trenches distribute stress and maintain thickness, preventing warpage during bonding of vertically arranged memory cells.

A stackable integrated circuit package uses a base recess and top protrusion to align interconnects during vertical stacking.

Perpendicular terminal mounting eliminates wire bonding space, reducing module size and connection defects.

A magnetic detection device uses a sealing member to separate the sensor from the conductor, ensuring effective electrical insulation.

Trenches in semiconductor wafers enable electroless plating to join metal pads, preventing open defects from surface irregularities.

A trapezoidal patch raises the via bottom to flatten electrode pads, preventing depressions that compromise wire connection reliability.