Vacuum Soldering with Temporary Bonding for Precision Alignment
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Solution Overview
Problem
Existing soldering methods are inefficient and prone to mispositioning of components during the soldering process, leading to dimensional inaccuracies and increased energy costs due to multi-stage heating and cooling processes, which cannot be implemented under a vacuum atmosphere.
Innovation Solution
A method using a bonding material to provisionally connect components, ensuring they remain fixed relative to each other, with the bonding material evaporating before soldering, allowing for precise positioning and reduced thermal stress, and utilizing a stop apparatus to maintain spacing and alignment during the soldering process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multi-stage heating and cooling processes are used to achieve soldering, then solder connection quality is improved, but processing time increases and energy consumption increases
Solution Approach 1:
The patent combines multiple process stages (heating, soldering, cooling) into a single continuous vacuum chamber process. Components are temporarily fixed with bonding material, then the entire assembly is processed in one vacuum environment through heating to melt solder and subsequent cooling, eliminating the need for separate atmospheric processing stages and reducing overall processing time while maintaining connection quality.
Solution Approach 2:
The patent uses a vacuum atmosphere as an inert environment for the entire soldering process. This allows the bonding material to evaporate completely without contamination, and enables the soldering process to proceed without oxidation or other atmospheric interference, maintaining reliability while allowing continuous processing without atmospheric changes.
2Reliability
If multi-stage heating and cooling processes are used to achieve soldering, then solder connection quality is improved, but energy consumption increases
Solution Approach 1:
The patent combines multiple process stages (heating, soldering, cooling) into a single continuous vacuum chamber process. Components are temporarily fixed with bonding material, then the entire assembly is processed in one vacuum environment through heating to melt solder and subsequent cooling, eliminating the need for separate atmospheric processing stages and reducing overall processing time while maintaining connection quality.
Solution Approach 2:
The patent uses a vacuum atmosphere as an inert environment for the entire soldering process. This allows the bonding material to evaporate completely without contamination, and enables the soldering process to proceed without oxidation or other atmospheric interference, maintaining reliability while allowing continuous processing without atmospheric changes.
3Ease of operation
If components are handled outside the process chamber, then assembly flexibility is improved, but positioning accuracy deteriorates due to mispositioning risk
Solution Approach 1:
The patent applies bonding material to temporarily fix components in their correct positions before the soldering process. This preliminary fixing action ensures that components remain precisely positioned during handling and assembly operations outside the vacuum chamber, while still allowing the necessary flexibility for assembly operations. The temporary bonds are sufficient to maintain positioning accuracy but can be broken if repositioning is needed.
4Manufacturing precision
If bonding material is used to temporarily connect components, then positioning accuracy is improved, but the bonding material must evaporate completely before soldering
Solution Approach 1:
The patent uses a vacuum atmosphere as an inert environment for the entire soldering process. This allows the bonding material to evaporate completely without contamination, and enables the soldering process to proceed without oxidation or other atmospheric interference, maintaining reliability while allowing continuous processing without atmospheric changes.
Solution Approach 2:
The patent utilizes changes in vacuum pressure and temperature parameters to control the evaporation of bonding material. By maintaining a vacuum environment and heating to appropriate temperatures, the bonding material evaporates completely and controllably, leaving no residue that would interfere with soldering. This parameter control approach simplifies the overall process by eliminating the need for separate cleaning steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables quicker, more accurate, and cost-effective soldering with improved dimensional accuracy, eliminating the need for complex multi-stage processes and allowing for vacuum atmosphere operation.
Implementation Method 1
the bonding material is selected such that it evaporates without leaving any residue during production of the solder connection
Implementation Method 2
heating and melting solder material which is arranged between the components to be connected
Data Source
AI summary
The invention relates to a method for producing a solder connection between a plurality of components (12A, 12B) in a process chamber (74) sealed off from its surroundings by heating and melting solder material (16) which is arranged between the components (12A, 12B) to be connected.It is proposed that the components (12A, 12B) to be connected are provisionally connected with a bonding material (18) to form a solder group (10) in which the components (12A, 12B) are fixed relative to one another in a joining position.