Multi-Section Conductive Carrier for Power Semiconductor Packages
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Solution Overview
Problem
Power semiconductor packages in high voltage and temperature applications require large heat spreaders and conductive clips, increasing their size and electrical resistance sensitivity, which complicates packaging and thermal management.
Innovation Solution
A non-contiguous, multi-section conductive carrier is used to embed power switching stages, providing integrated heat spreading and eliminating the need for separate heat spreaders and conductive clips, while establishing a robust, low-resistance electrical connection between control and sync switches.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If large heat spreaders are used to protect power transistors from heat, then thermal protection is improved, but package size increases significantly
Solution Approach 1:
The patent merges the heat spreader and conductive clip into a single integrated carrier structure. The carrier includes a body portion that serves as the heat spreader and extends into a conductive clip portion that provides electrical connection, eliminating the need for separate heat spreader and conductive clip components.
Solution Approach 2:
The carrier structure performs multiple functions simultaneously: it provides thermal management through heat spreading, electrical connection through the conductive clip portion, and mechanical support for mounting power transistors. This multi-functional design reduces the number of discrete components needed.
2Reliability
If large conductive clips are used to connect control and sync transistors, then electrical connection robustness is improved, but package size increases
Solution Approach 1:
The conductive clip function is merged into the carrier body, which extends from the heat spreader portion to form an integrated conductive path. This eliminates the need for separate conductive clips while maintaining robust electrical connection for high current applications.
Solution Approach 2:
The carrier is made from electrically conductive material that provides both thermal management and electrical connection properties. The conductive material is configured to provide low electrical resistance paths for high current while maintaining structural integrity.
3Reliability
If separate heat spreaders and conductive clips are used, then thermal and electrical functions are fulfilled, but device complexity increases
Solution Approach 1:
The patent combines multiple discrete components (heat spreader, conductive clip, mounting structure) into a single integrated carrier. This simplifies the packaging structure by reducing the number of parts that need to be manufactured, handled, and assembled.
Solution Approach 2:
The carrier serves as a multi-functional component that provides thermal management, electrical connection, and mechanical support simultaneously. This eliminates the need for separate dedicated components for each function, reducing overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces package size, enhances thermal performance, and minimizes parasitic components, enabling more compact and efficient power semiconductor packages with improved heat dissipation and electrical connectivity.
Implementation Method 1
conductive carrier sections 210b and 210d are configured to conduct heat away from control FET 220 and sync FET 230, respectively
Implementation Method 2
conductive carrier section 210e can be used to establish a robust, low-resistance electrical connection for providing switch node contact 529
Data Source
AI summary
In one implementation, a power semiconductor package includes a non-contiguous, multi-section conductive carrier. A control transistor with a control transistor terminal is coupled to a first section of the multi-section conductive carrier, while a sync transistor with a sync transistor terminal is coupled to a second section of the multi-section conductive carrier. The first and second sections of the multi-section conductive carrier sink heat generated by the control and sync transistors. The first and second sections of the multi-section conductive carrier are electrically connected only through a mounting surface attached to the power semiconductor package. Another implementation of the power semiconductor package includes a driver IC coupled to a third section of the multi-section conductive carrier. A method for fabricating the power semiconductor package is also disclosed. The power semiconductor package according to the present disclosure results in effective thermal protection, current carrying capability, and a relatively small size.