Semiconductor Device Thin Resin Heat Dissipation
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Solution Overview
Problem
Conventional semiconductor devices require thick insulating resin sheets for thermal conductivity and rigidity, leading to increased size and manufacturing costs, and potential chipping or cracking during handling.
Innovation Solution
A semiconductor device design with a first insulating resin member for mounting and a second insulating resin member for heat dissipation, where the thickness of the second resin member is reduced to improve heat dissipation while maintaining rigidity, using a transfer molding process and incorporating fillers like silica or alumina for enhanced thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a thick insulating resin sheet is used to ensure rigidity and thermal conductivity, then the structural stability and heat dissipation are improved, but the device size increases and the risk of chipping or cracking during handling also increases
Solution Approach 1:
The patent applies composite materials by combining insulating resin with heat-conductive fillers (such as metal powder, ceramic powder, or graphite) to create a resin composition that simultaneously achieves rigidity, thermal conductivity, and resistance to chipping/cracking without requiring increased thickness. The composite structure allows the resin to maintain mechanical strength while dissipating heat effectively.
Solution Approach 2:
The patent changes the physical and chemical parameters of the insulating resin by adjusting the type, amount, and size of heat-conductive fillers incorporated into the resin composition. By optimizing these parameters, the resin achieves enhanced thermal conductivity and mechanical properties, allowing thin-film design while maintaining reliability and heat dissipation performance.
2Temperature
If a thick insulating resin sheet is used to ensure thermal conductivity, then heat dissipation is improved, but manufacturing costs increase due to additional metal plates and complex processes
Solution Approach 1:
The patent incorporates heat-conductive fillers (metal powder, ceramic powder, or graphite) directly into the insulating resin to create a composite material with inherent thermal conductivity. This eliminates the need for separate metal plates or complex heat dissipation structures, simplifying manufacturing and reducing costs while maintaining effective heat dissipation.
Solution Approach 2:
The patent merges the functions of insulation and heat dissipation into a single resin composition. By combining insulating properties with heat-conductive fillers, the resin simultaneously provides electrical insulation and thermal management, eliminating the need for separate components and reducing manufacturing complexity.
3Strength
If a thick insulating resin sheet is used to ensure rigidity, then structural stability is improved, but the risk of chipping or cracking during handling increases
Solution Approach 1:
The patent uses composite materials combining insulating resin with heat-conductive fillers to enhance both rigidity and resistance to chipping/cracking. The filler particles reinforce the resin matrix, improving mechanical strength and fracture resistance while maintaining the required rigidity for structural stability.
Solution Approach 2:
The patent optimizes the physical and chemical parameters of the resin composition, including filler type, amount, size distribution, and resin matrix properties, to achieve the optimal balance between rigidity and fracture resistance. This allows the resin to be sufficiently rigid for structural support while being resistant to chipping and cracking during handling.
4Temperature
If different thermal conductivity resins are used for power semiconductor elements and control IC chips, then heat dissipation from power elements is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent applies local quality by incorporating heat-conductive fillers uniformly into the insulating resin composition, creating regions of enhanced thermal conductivity throughout the resin. This allows heat from both power semiconductor elements and control IC chips to be dissipated effectively through the same resin material, eliminating the need for different resin types for different components.
Solution Approach 2:
The patent creates a universal insulating resin composition with heat-conductive properties that can be used for all semiconductor elements, regardless of their power dissipation requirements. The resin simultaneously provides electrical insulation, thermal management, and mechanical support for both power elements and control IC chips, simplifying device design and manufacturing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables improved heat dissipation and reduced size without increasing the resin thickness, reducing the risk of chipping or cracking and lowering manufacturing costs by eliminating the need for additional metal plates, while maintaining high productivity and adhesion between resin members and the lead frame.
Implementation Method 1
high thermal conductivity is required of the insulating resin used for the sealing
Implementation Method 2
a surface (mounting surface) of a lead frame, on which a semiconductor element is mounted, and a heat dissipating surface opposite to the mounting surface, are sealed with an insulating resin by transfer molding
Data Source
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AI summary
A semiconductor device includes a first insulating resin member (7) sealing a mounting surface (2a) of a lead frame (2), and a second insulating resin member (8) sealing a heat dissipating surface (2b). The second insulating resin member (8) contains a filler (18) having a maximum diameter of 0.02 mm to 0.075 mm. The second insulating resin member (8) includes a thin molded portion (10) formed in contact with the heat dissipating surface (2b) of the lead frame (2). The thin molded portion (10) has a thickness 1.1 times to 2 times the maximum diameter of the filler (18). The semiconductor device includes, at an interface between the first insulating resin member (7) and the second insulating resin member (8), a mixture layer in which these resins are mixed with each other.