Touch Sensor Module Embedding via Two-Die Molding
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Solution Overview
Problem
The existing methods for manufacturing device modules with embedded transmission cables face difficulties in inserting the cable's protruding portion into a die housing recess due to the need for a conforming recess shape, making the process challenging and prone to plastic material ingress.
Innovation Solution
The use of a two-die system where the first die injects plastic material around the embedded portion of the external connection, allowing the lead-out portion to protrude without requiring it to be inserted into a housing recess, thereby simplifying the manufacturing process and reducing the risk of plastic material ingress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the housing recess shape conforms to the outer shape of the transmission cable's second portion, then plastic material ingress is prevented, but insertion difficulty increases significantly
Solution Approach 1:
The patent removes the housing recess structure from the die, extracting the problematic component that caused both plastic material ingress and insertion difficulty. Instead of forming a recess to accommodate the transmission cable's second portion, the cable is allowed to protrude freely from the molded plastic part, eliminating the insertion step entirely while preventing plastic material from entering where a recess would have been.
Solution Approach 2:
The transmission cable's second portion is positioned in advance during assembly before molding, allowing it to protrude from the plastic part without requiring a pre-formed housing recess. This preliminary positioning eliminates the need for complex recess shaping and insertion operations during the molding process.
2Ease of manufacture
If the housing recess is eliminated and the lead-out portion simply protrudes, then manufacturing complexity is reduced, but plastic material ingress risk increases
Solution Approach 1:
By removing the housing recess structure entirely, the patent eliminates the complex interaction between plastic material flow and recess geometry. The transmission cable's second portion protrudes freely without a recess to trap plastic material, simplifying the molding process while actually reducing ingress risk through the elimination of potential trap zones.
3Productivity
If a two-die system is used to embed the external connection, then manufacturing efficiency improves, but device complexity increases
Solution Approach 1:
The patent divides the manufacturing process into two sequential die operations: first die forms the plastic part with embedded external connection, second die completes the molding. This segmentation allows each die to perform a simplified function, improving overall manufacturing efficiency while the modular nature of sequential processing keeps system complexity manageable.
Solution Approach 2:
The patent combines multiple functions into the molding process itself - the external connection is embedded within the plastic part during molding, and the transmission cable's second portion is simultaneously positioned to protrude. This merging of embedding and positioning operations into a single molding step improves productivity without requiring additional complex equipment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient manufacturing of device modules by embedding the touch sensor and external connection within the plastic part while allowing the lead-out portion to protrude, reducing the complexity of the insert-molding process and minimizing the risk of material ingress, thus enhancing production efficiency.
Implementation Method 1
The use of a two-die system where the first die injects plastic material around the embedded portion of the external connection, allowing the lead-out portion to protrude without requiring it to be inserted into a housing recess
Data Source
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AI summary
The invention provides a device module that can be manufactured without inserting a part of an external connection into a housing recess of a die. A method of manufacturing the device module is also provided. The device module includes a base 100, a plastic part 200 provided on the base 100, a touch sensor 300 provided on the base 100 and embedded in the plastic part 200, and an external connection 400. The external connection 400 includes an embedded portion 410 and a lead-out portion 420. The embedded portion 410 is connected to the touch sensor 300, extends along the base 100, and is embedded in the plastic part 200. The lead-out portion 420 is contiguous with the embedded portion 410 and led out of the plastic part 200.