Power Semiconductor Module Perpendicular Terminal Mounting
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Solution Overview
Problem
The size reduction of resin-sealed power semiconductor modules is restricted due to the need for a wide space for wire bonding equipment, which is necessary for connecting main and control terminals.
Innovation Solution
A power semiconductor module configuration that eliminates the need for wire bonding by using a circuit substrate with a metal heat sink, high thermal conductive insulation layer, and wiring metal plates to connect power semiconductor elements and terminals, allowing for perpendicular mounting of cylindrical main and control terminals, which are then sealed with transfer molding resin.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonding is used to electrically connect power semiconductor elements and terminals, then reliable electrical connections are achieved, but a wide space is required for wire bonding equipment operation which restricts size reduction of the module
Solution Approach 1:
The invention extracts and eliminates the wire bonding process and associated equipment from the module structure. By using direct metallurgical connections through the circuit substrate and terminal structures, the patent removes the need for wire bonding equipment operation space, thereby enabling significant size reduction while maintaining electrical connection reliability
Solution Approach 2:
The invention replaces the mechanical wire bonding system with a metallurgical joining system. The terminal structures are directly connected to the circuit substrate through soldering or other metallurgical bonding methods, eliminating the need for mechanical wire bonding equipment and reducing the overall module volume
2Ease of manufacture
If wire bonding is used for electrical connections within the module, then power semiconductor elements can be connected to terminals, but additional circuit patterns are required which increases device complexity and restricts size reduction
Solution Approach 1:
The invention merges the terminal mounting function and circuit pattern function into a single integrated structure. The terminals are directly mounted on the circuit substrate with their connection paths formed as integral parts of the substrate structure, eliminating the need for separate circuit patterns and reducing device complexity
3Ease of operation
If a wide space is provided between main/control terminals and wire bonding locations, then wire bonding equipment can operate properly, but the module size cannot be reduced
Solution Approach 1:
The invention extracts the wire bonding operation from the manufacturing process entirely. By using direct metallurgical connections where terminals are soldered or bonded directly to the circuit substrate, the patent eliminates the need for wire bonding equipment operation space, enabling compact module design
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables a further reduction in size of the power semiconductor module, improves manufacturing productivity, and reduces the rate of defective connections, resulting in a more compact and reliable module.
Implementation Method 1
a high thermal conductive insulation layer joined to one surface of the metal heat sink
Implementation Method 2
transfer molding resin for sealing, at least, the high thermal conductive insulation layer, the circuit pattern, the power semiconductor elements, the wiring metal plate, outer side surfaces of the main terminals, and an outer side surface of the control terminal
Data Source
AI summary
In the power semiconductor module, a wiring metal plate electrically connects between power semiconductor elements joined to the circuit pattern, and between the power semiconductor elements and the circuit pattern. Cylindrical main terminals are joined, substantially perpendicularly, to the wiring metal plate and the circuit pattern, respectively. A cylindrical control terminal is joined, substantially perpendicularly, to one of the power semiconductor elements.