Sensor Device Self-Diagnosis with Isolated Processors
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Solution Overview
Problem
Existing sensor devices lack effective redundancy mechanisms to ensure continuous operation when abnormalities occur, as they either require multiple high-function chips, increasing costs, or face the risk of simultaneous failures due to electrical connectivity between processors.
Innovation Solution
A sensor device with a processing chip that includes a semiconductor substrate, two processors, and an isolation portion, where each processor self-diagnoses failures and outputs identifiable signals, allowing for electrical isolation and redundant operation without the need for separate chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple high-function chips are used to ensure redundancy, then reliability is improved, but device complexity and cost increase
Solution Approach 1:
The patent merges multiple processor functions into a single processing chip by integrating a normal processor and a diagnostic processor on the same semiconductor substrate. This consolidation maintains redundancy capabilities while reducing the number of separate chips and interconnections required, thereby lowering device complexity and cost.
Solution Approach 2:
The processing chip is designed with multi-functionality by incorporating both normal processing capabilities and self-diagnostic capabilities within the same chip. The diagnostic processor can independently monitor and diagnose the normal processor, enabling the single chip to perform multiple functions that would traditionally require separate components.
2Loss of information
If processors are electrically connected for communication, then information exchange is improved, but the risk of simultaneous failures increases
Solution Approach 1:
The patent segments the processing functions into distinct normal processor and diagnostic processor units on the same chip, with separate electrical connection paths. This segmentation allows the diagnostic processor to independently monitor the normal processor through dedicated diagnostic circuits, enabling information exchange while minimizing the risk that a single electrical failure affects both processors simultaneously.
3Reliability
If self-diagnosis functionality is added to processors, then reliability is improved, but device complexity increases
Solution Approach 1:
The self-diagnosis functionality is merged with the normal processing functions by integrating the diagnostic processor and diagnostic circuits on the same semiconductor substrate as the normal processor. This combination enables self-diagnosis capabilities while sharing common chip infrastructure, reducing the complexity increase that would result from entirely separate diagnostic systems.
Data Source
AI summary
A sensor device includes: a first sensor element; a second sensor element; and a processing chip that includes a semiconductor substrate, a first processor that receives a first detection signal and processes the first detection signal, a second processor that receives the second detection signal and processes the second detection signal, and an isolation portion that electrically isolates the first processor the second processor. The first processor includes a first diagnosis unit that self-diagnoses a presence or absence of a failure. The second processor includes a second diagnosis unit that self-diagnoses a presence or absence of a failure. The processing chip identifiably outputs a first output of the first processor and a second output of the second processor.