Embedding Thin Chips in Flexible Polymer Substrates
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Solution Overview
Problem
Traditional integrated circuit (IC) chips and printed circuit boards (PCBs) are thick and rigid, making them incompatible with thinner chips and stretchable interconnects, which limits the embedding of such components in flexible polymers.
Innovation Solution
The development of a substrate with a standoff well region or polymer well region in flexible polymers, where a thin chip is disposed on an adhesive material within the well region, surrounded by conductive material, allowing for electrical communication through vias and positioning the chip at a neutral mechanical plane for flexibility and stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If traditional thick and rigid IC chips and PCBs are used, then structural strength and stability are improved, but compatibility with flexible polymers and stretchable interconnects deteriorates
Solution Approach 1:
The patent replaces traditional rigid PCBs with flexible polymer substrates that can be stretched and deformed. The embedded chips are surrounded by flexible polymer material that allows the overall structure to be stretched without damaging the embedded components, thus achieving compatibility with flexible polymers while maintaining structural integrity through proper embedding design.
Solution Approach 2:
The patent transitions from planar surface mounting to three-dimensional embedding within the polymer substrate. By embedding chips volumetrically within the flexible polymer rather than mounting them on the surface, the structure gains the ability to stretch and deform while maintaining electrical connectivity and structural strength.
2Adaptability or versatility
If chips are embedded in flexible polymers using conventional schemes, then flexibility is improved, but manufacturing compatibility for thin chips deteriorates
Solution Approach 1:
The patent performs preliminary actions by first forming the flexible polymer substrate with embedded conductive interconnects before placing the thin chips. The polymer is prepared with recesses or cavities that are sized appropriately for the thin chips, and conductive pathways are established in advance, making the subsequent chip embedding process straightforward and manufacturable.
Solution Approach 2:
The patent introduces adhesive materials as intermediaries between the thin chips and the flexible polymer substrate. These adhesives facilitate proper bonding and electrical connectivity while accommodating the thin profile of modern chips, thus improving manufacturing compatibility without compromising flexibility.
3Adaptability or versatility
If thin chips are used, then compatibility with flexible polymers is improved, but structural stability and mechanical strength deteriorate
Solution Approach 1:
The patent embeds thin chips within the flexible polymer substrate, surrounding them with polymer material that provides mechanical support and stability. The chips are nested within the polymer matrix, which protects them from mechanical damage while allowing the overall structure to flex and stretch, thus maintaining both compatibility and structural stability.
Solution Approach 2:
The patent creates a composite structure combining thin semiconductor chips with flexible polymer materials and conductive interconnects. This composite construction leverages the strengths of each material: the thin chips provide functionality while the polymer provides flexibility and mechanical stability, achieving both compatibility and structural integrity.
Data Source
AI summary
Systems and methods are provided for the embedding of thin chips. A well region is generated in a substrate that includes a conductive material disposed on a flexible polymer. The standoff well region can be generated by pattern the conductive material, where the thin chip is embedded in the standoff well region. A cavity can be generated in the polymer layer to form a polymer well region, where the thin chip is embedded in the polymer well region.