Circuit Bendability/Stretchability TRIZ Cases

Matching a bent photosensitive assembly to the lens field curvature eliminates distortion without adding lenses that increase weight.

Angled LED tabs and sealant housings distribute light evenly, resolving uneven dispersion without requiring multiple fixed-density chains.

Roll pressed structures in the rigid area reduce stress concentrations at the connection point, enhancing structural integrity of the display device.

Integrating signal processing circuitry into a hermetically sealed load sensing assembly eliminates signal loss and interference from long wired connections.

Magnetic alignment of conductive particles creates reliable interconnects that prevent leakage and shorting during repeated flex cycles.

Segmenting the polymer layer into rigid and flexible zones prevents substrate stretching during heat-pressing, preserving pad alignment precision.

A semiconductor package structure uses stacked redistribution layers to connect chips with exposed contact pads.

Slit-based bellows deformation enables a 200% expansion ratio in an insulating film substrate, preventing planar distortion of arranged components.

Integrating mm-Wave and non-mm-Wave antennas on a flexible PCB reduces mutual interference while optimizing space utilization in compact 5G devices.

A composite circuit board uses a thinning groove to expose the flexible substrate for precise protective adhesive deposition.

Peripheral groove structures capture extruded conductive particles to prevent short circuits between adjacent bonding pads.

Controlled outgassing and thickness minimize distortion from thermal mismatch during lamination.

A photosensitive resin composition with a protected polycarbodiimide thermosetting agent forms a solder resist film.

Flexible printed circuit antenna extenders bridge distance constraints between deep tissue implants and external readers, enabling reliable energy delivery.

A foldable printed circuit board forms a convex polyhedron to house electronic components in a compact volume.

Segmented closed loop parts connected by line parts distribute lateral stress, preventing damage and maintaining conductivity under tension.

A signal pad with a bonded region and an unbonded margin region connects to an external circuit structure on a dielectric layer.

A flexible printed circuit board uses dummy portions and concave regions to increase bonded area and absorb external impacts.

Selective strand coupling prevents unintended shorts at intersections, ensuring reliable electrical conductivity in woven fabrics.

Positioning ground wiring near flexible part edges suppresses cracks at rigid boundaries, preventing insulating failures and wiring disconnections.

Composite bases prevent electric disconnection during frequent deformation cycles in expandable sensors.

Segmented flexible layers anchor to an elastomer foundation, maintaining electrical continuity during elastic deformation.

A semi-flexible component carrier uses a stepped recess in insulating layers to distribute mechanical stress and prevent cracking.

A rigid-flex component carrier uses a cavity step to redirect tensile forces into compressive stress at the transition region.

A stretchable wiring board design uses controlled peeling strength differences between the main body and conductive wirings to manage mechanical stress.

A printed wiring board uses region-specific lamination to enhance bending resistance while maintaining reduced thickness.

Laminating a protective layer over the coupling portion prevents tearing and rupture when the flexible region bends, ensuring structural integrity.

Orienting the semiconductor layer at an angle reduces segment length and mechanical stress, preventing cracks during bending.

A compressible layer moves a magnet relative to an inductive coil, enabling wideband frequency response and reducing mechanical wear in VR systems.

A radiused portion and clamp mechanism shape flexible flat cables into controlled arcs.

Light-absorbing test patterns on a transmitting base substrate enable precise defect detection and sorting of flexible film areas.

Segmented line units with filled holes block crack propagation and reduce resistance during stretching.

Porous membranes absorb conductive inks to maintain electrical connectivity during repeated washing and stretching.

Layered bonding and protective sheets create a stepped structure that prevents signal line damage during dielectric cutting, maintaining optimal impedance.

Elastomeric encapsulation layer absorbs mechanical stress at rigid component interfaces, preventing conductive thread breakage and connection failure.

Segmenting the sensor module from the clothing body allows independent cleaning, resolving durability issues while maintaining reliable motion monitoring.

A printed circuit board uses a groove in the flexible region to guide adhesive flow between substrates.

Standoff well regions in flexible polymers embed thin chips at neutral planes, resolving rigidity conflicts while maintaining structural stability.

Graded Young's modulus ratios between encapsulation and redistribution layers cushion external impacts, preventing device damage while maintaining flexibility.

Merges the wireless charging structure into the display stack to reduce DC resistance and surface heat generation while improving charging efficiency.

A stretchable fabric electrode belt integrates conductive yarn and a flexible circuit unit to measure biometric signals via impedance.

Distributed stiff resin layers prevent peeling and deformation by balancing mechanical strength with stress distribution.

Bending guide members in a link assembly maintain stable curvature and minimize stress on the flexible display panel.

A self-healing wire uses a conductive fluid coating to bridge cracks in metal cores during stretching.

Variable chamfered gaps between the FPC and glass substrate relieve thermal expansion stress without increasing resin volume, preventing disconnection.

A flexible display panel uses grooves in the inorganic layer to house metal wires, creating a structural path that accommodates bending deformation.

A printed circuit board with a rigid core and flexible periphery extends between cylindrical housing walls to establish electrical contact.

Segmented rib lines enable precise stress measurement across sub-segments, resolving layout complexity trade-offs.