Foldable PCB Polyhedron for Thermal Management and Component Density
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Solution Overview
Problem
Current methods for assembling electronic components are limited in creating a protected, universal, three-dimensional electronic unit with high component density, efficient heat dissipation, and the ability to use through-hole elements, due to issues such as difficulty in extracting heat from closed cavities and limited configurational options.
Innovation Solution
A foldable printed circuit board with marked folding portions and a metal base acting as a heat sink, allowing for a compact, polyhedron configuration with surface-mount and through-hole components, and improved heat dissipation through a polyhedron structure with a heat-conductive aluminum base.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If a closed cavity three-dimensional unit is used, then component density is improved, but heat dissipation becomes difficult
Solution Approach 1:
The patent transitions from planar two-dimensional PCB layouts to three-dimensional folded structures, utilizing vertical space and multiple folding layers to increase component density while maintaining heat dissipation pathways through the folded geometry and heat sink integration
2Device complexity
If through-hole elements are not used, then manufacturing complexity is reduced, but component versatility is limited
Solution Approach 1:
The patent creates a universal mounting structure that accommodates both surface-mount and through-hole components through the same folded PCB framework, allowing the system to support diverse component types without requiring separate manufacturing processes or structural designs
3Stability of the object's composition
If a rigid fixed structure is used, then structural stability is improved, but configurational adaptability is reduced
Solution Approach 1:
The patent employs foldable joints and articulated connections that allow the structure to be assembled in different configurations while maintaining structural integrity, enabling the same rigid framework to adapt to various component layouts and spatial requirements
4Object-affected harmful factors
If electromagnetic shielding is intensified, then electromagnetic interference is reduced, but device complexity increases
Solution Approach 1:
The patent integrates electromagnetic shielding functions directly into the PCB ground planes and metal enclosure structures, combining multiple functions (structural support, heat dissipation, and EMI shielding) into unified components rather than adding separate shielding elements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves improved weight-and-size characteristics, enhanced heat dissipation, and intensive electromagnetic shielding, enabling a more compact and efficient electronic module with better thermal management and component integration.
Implementation Method 1
a metal base configured to operate as a heat sink
Implementation Method 2
improved heat dissipation through a polyhedron structure with a heat-conductive aluminum base
Implementation Method 3
intensive electromagnetic shielding behavior
Data Source
AI summary
Systems and methods of providing a three-dimensional electronic module having high component density are disclosed. In some cases, the module has improved heat dissipation, reduced weight and size, and increased protection against electromagnetic radiation. In some cases, the module includes a printed circuit board configured to be folded into a convex polyhedron, with the polyhedron's faces formed by sections of the printed circuit board. In some cases, the electronic components face the interior of the circuit board and fall into gaps between the components installed on the other sections.