Stretchable Multilayer Electronics Anchoring

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Solution Overview

Problem

Interconnecting multiple layers of electronic components in an elastic substrate while ensuring the interconnections withstand elastic deformations of the substrate is a challenge.

Innovation Solution

The solution involves coupling flexible layers with anchoring sites to an elastomer foundation at multiple anchoring points, using bonding sites with higher durometer than the elastomer to increase rigidity and create rigid islands for electrical connections, and encapsulating with an elastomeric overmold to maintain structural integrity during deformation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If flexible layers are coupled to elastomer foundation at multiple anchoring points, then the device can withstand elastic deformations, but the device complexity increases

Engineering Contradiction:

Improvewithstand elastic deformationsVSAvoiddevice complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The flexible layers are divided into multiple segments between anchoring points, allowing each segment to independently deform elastically. This segmentation enables the structure to accommodate substrate deformation while maintaining overall integrity, resolving the contradiction between reliability during elastic deformation and device complexity.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent employs flexible layers with suspended segments that can bend and deform elastically. These thin film structures are specifically designed to stretch and conform to substrate deformation, providing reliable electrical connections even when the elastomer foundation undergoes significant elastic deformation, thus addressing the reliability-complexity tradeoff.

Inventive Principle:

Principle #30Flexible shells and thin films

2Strength

If bonding sites with higher durometer are used to create rigid islands, then electrical connections are strengthened, but the device becomes less adaptable to deformation

Engineering Contradiction:

Improveelectrical connectionsVSAvoidadaptability to deformation

Core Design Contradiction:

StrengthVSAdaptability or versatility

Solution Approach 1:

The patent implements local quality by creating rigid islands at specific bonding sites where electrical connections are required, while the surrounding flexible layers remain soft and compliant. This localized rigidity provides strong electrical connections exactly where needed, while the rest of the structure maintains adaptability to deformation, resolving the contradiction between connection strength and overall deformability.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The flexible layers are segmented into suspended portions between rigid bonding sites, allowing the structure to combine localized rigidity for electrical connections with overall flexibility for deformation accommodation. The suspended segments act as compliant interconnects that can stretch while maintaining electrical continuity.

Inventive Principle:

Principle #1Segmentation

3Reliability

If elastomeric overmold is used to encapsulate the device, then structural integrity during deformation is maintained, but manufacturing complexity increases

Engineering Contradiction:

Improvestructural integrityVSAvoidmanufacturing complexity

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The elastomeric overmold merges the flexible layers, elastomer foundation, and anchoring structures into a single integrated encapsulated unit. This unified structure maintains structural integrity during deformation while simplifying manufacturing by treating the entire assembly as one component that can be molded and assembled as a complete unit, reducing the number of separate assembly steps.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration allows the electronic device to withstand elastic deformations without damaging the interconnections, maintaining electrical communication and structural integrity by allowing the flexible layers to move in unison with the elastomer foundation, reducing stress on anchoring and bonding sites.

Implementation Method 1

The first flexible layer may include anchoring sites. The anchoring sites may be coupled to the elastomer foundation at a plurality of anchoring points... This configuration allows the electronic device to withstand elastic deformations without damaging the interconnections

Methodology Applied

Scientific EffectElasticity: Elasticity

Data Source

PatentUS10375831B2Stretchable multilayer electronics

Publication Date: 2019.08.06 INTEL CORP

AI summary

An electronic device may include a first flexible layer. The first flexible layer may include a first flexible substrate. The first flexible layer may include a first conductive layer. The first conductive layer may be coupled to the first flexible substrate. The electronic device may include a second flexible layer. The second flexible layer may be coupled to the first flexible layer. The second flexible layer may be coupled to the first flexible layer at a first distance. The second flexible layer may include a second flexible substrate. The second flexible layer may include a second conductive layer. The second conductive layer may be coupled to the second flexible substrate. The electronic device may include an elastomer foundation. The first flexible layer may include anchoring sites. The anchoring sites may be coupled to the elastomer foundation at a plurality of anchoring points.