Flexible Interconnect With Liquid Metal And Magnetic Encapsulant
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Solution Overview
Problem
Flexible electrical interconnects in devices with moveable components are prone to damage from repeated flexing, leading to breakage of solid metal traces, and forming connections with liquid metal conductors through encapsulants poses challenges such as leakage and shorting.
Innovation Solution
A flexible interconnect using a liquid metal conductor embedded in a conductively anisotropic, magnetic particle-embedded encapsulant that aligns magnetically to form self-healing pathways, preventing shorting and leakage by maintaining aligned conductive paths even under deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solid metal traces are used in flexible interconnects, then electrical conductivity is achieved, but the traces are prone to fatigue and breakage after repeated flexing
Solution Approach 1:
The patent replaces solid metal traces with liquid metal conductors that flow within flexible encapsulant channels. This hydraulic approach allows the conductor to continuously redistribute and self-heal during flexing cycles, eliminating fatigue and breakage issues associated with solid metal traces while maintaining electrical conductivity.
Solution Approach 2:
The patent creates a composite structure combining liquid metal conductors with flexible encapsulant materials. This composite approach integrates the electrical conductivity of liquid metal with the mechanical flexibility and protection of the encapsulant, resolving the contradiction between structural integrity and fatigue resistance.
2Reliability
If liquid metal conductors are used in flexible interconnects, then resistance to fatigue and deformation is improved, but challenges arise in forming connections through encapsulants without leakage or shorting
Solution Approach 1:
The patent introduces magnetically alignable conductive particles as an intermediary between the liquid metal conductor and external connection points. These particles form controlled conductive pathways through the encapsulant when exposed to magnetic fields, enabling reliable connections without direct penetration that could cause leakage or shorting.
Solution Approach 2:
The patent changes the magnetic properties of the encapsulant by embedding magnetically alignable conductive particles. This parameter change allows the encapsulant to transition from a simple barrier to an active connection medium that can be magnetically controlled to form conductive pathways, enabling reliable connections while preventing leakage.
3Reliability
If magnetically alignable conductive particles are embedded in encapsulant, then conductive pathways can be formed without shorting, but the encapsulant structure becomes more complex
Solution Approach 1:
The patent employs self-service by using magnetic fields to automatically align the conductive particles into desired pathways. The magnetic alignment process is self-organizing and requires no manual intervention, forming precise conductive pathways through the encapsulant while maintaining structural simplicity and manufacturing efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides reliable and durable electrical connections that resist fatigue and deformation, preventing signal path breakages and ensuring consistent conductivity across multiple flex cycles.
Implementation Method 1
a conductively anisotropic, magnetic particle-embedded encapsulant that interfaces with the liquid conductive pathway
Implementation Method 2
the ability for the liquid metal to flow imparts self-healing characteristics to such an interconnect
Implementation Method 3
forming connections with liquid metal conductors through encapsulants poses challenges such as leakage and shorting
Data Source
Figure 1A~1B
Figure 1C
Figure 2
AI summary
One example provides a flexible electrical interconnect comprising a substrate, a liquid conductive pathway supported by the substrate, and a conductively anisotropic, magnetic particle-embedded encapsulant that interfaces with the liquid conductive pathway for connecting to another circuit element.