Flexible Hybrid Electronic System Impact Absorption
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Solution Overview
Problem
Flexible hybrid electronic devices face reliability issues due to varying stress and impact forces in different application fields, leading to potential damage and malfunction.
Innovation Solution
A flexible hybrid electronic system is designed with specific redistribution structures and encapsulation layers having tailored thicknesses and Young's moduli ratios to absorb and cushion impact, improving mechanical strength without additional shock-absorbing structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If flexible hybrid electronic devices are designed with different device structures for various application fields, then adaptability to different wearing methods and impact forces is improved, but reliability becomes difficult to control and products are prone to damages
Solution Approach 1:
The patent applies parameter changes by precisely controlling the Young's modulus ratios between different layers (encapsulation layer, redistribution structure, carrier) and their thickness ratios. The encapsulation layer's Young's modulus is designed to be 0.1-10 times that of the redistribution structure, which is 0.1-10 times that of the carrier, creating a graduated stiffness profile that adapts to various impact conditions while maintaining reliable stress distribution across all device components.
Solution Approach 2:
The patent employs composite material principles by creating a multi-layer structure where each layer has different mechanical properties. The encapsulation layer, redistribution structure, and carrier are designed as composite layers with specifically engineered Young's modulus and thickness ratios, forming a hierarchical composite system that simultaneously provides adaptability to different impacts and controlled reliability through predictable stress distribution.
2Strength
If additional shock-absorbing structures are added to improve impact resistance, then mechanical strength is enhanced, but device complexity increases
Solution Approach 1:
The patent applies universality by making the encapsulation layer serve multiple functions: it provides mechanical strength and impact resistance while simultaneously acting as a stress-distributing element and structural component. The redistribution structure also performs dual roles in electrical signal redistribution and mechanical shock absorption, eliminating the need for separate shock-absorbing components and reducing overall device complexity.
Solution Approach 2:
The patent achieves enhanced mechanical strength through parameter changes in the existing structural layers rather than adding new components. By optimizing the Young's modulus ratios (encapsulation layer 0.1-10 times the redistribution structure, which is 0.1-10 times the carrier) and thickness ratios, the existing layers are transformed into an integrated shock-absorbing system that provides superior impact resistance without increasing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively cushions and absorbs energy, enhancing mechanical strength and reducing damage from external impacts, maintaining flexibility and functionality in wearable and in-vehicle applications.
Implementation Method 1
the stress on each device in the system is different according to the user's application field/wearing method and impact force
Data Source
AI summary
A flexible hybrid electronic (FHE) system includes a carrier, a first redistribution structure on the carrier, a first device on the first redistribution structure, and an encapsulation layer encapsulating the first device. The carrier has a first Young's modulus Y1. The first redistribution structure has a second Young's modulus Y2. The first device and a portion of the encapsulation layer form a top surface of the first redistribution structure to a top surface of the first device is a first portion having a third Young's modulus Y3. The other portion of the encapsulation layer from the top surface of the first device to a top surface of the encapsulation layer is a second portion having a fourth Young's modulus Y4. A ratio of Y3/Y4 is between 1.62 and 1.98; a ratio of Y3/Y2 is between 0.18 and 0.22; and a ratio of Y3/Y1 is between 280.62 and 342.98.