Embedded Different-Material Adhesive Sheet for Void-Free Insulation
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Solution Overview
Problem
The entrapment of air at the interface of adhesive sheets in semiconductor modules, particularly when a different material sheet is incorporated, leads to voids and reduced insulation reliability, posing a challenge in forming electrically insulating layers.
Innovation Solution
An adhesive sheet with a first adhesive surface having a flush interface between an adhesive resin composition and a smaller, embedded different material sheet, and a method of producing this sheet by forming a double-layer structure with a copper foil and hot-pressing to ensure a seamless adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a different material sheet is incorporated into the adhesive sheet to provide additional functions, then the adhesive sheet can be utilized in various applications, but air is likely to be entrapped at the location with the step formed by the protruding different material sheet
Solution Approach 1:
The different material sheet is embedded within the adhesive resin composition, with its thickness being smaller than that of the adhesive sheet. This nesting approach allows the different material sheet to be integrated into the adhesive sheet structure without protruding, thereby preventing air entrapment while still providing additional functions through the exposed different material sheet on the adhesive surface.
2Reliability
If two or more adhesive sheets are laminated to form a highly-reliable electrically insulating layer, then the possibility of defects such as voids or cracks is reduced, but the complexity of the structure increases
Solution Approach 1:
The invention creates a composite adhesive sheet by embedding a different material sheet within the adhesive resin composition. This composite structure integrates multiple materials into a single layer, providing both the adhesive properties of the resin composition and the additional functions of the different material sheet, thereby achieving high reliability without requiring multiple laminated layers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses air entrapment, ensuring a reliable electrically insulating layer with enhanced insulation and thermal conductivity, thereby improving the semiconductor module's performance.
Implementation Method 1
an adhesive sheet composed of an adhesive resin composition including an inorganic filler
Implementation Method 2
heat radiation measures are taken by, for example, forming a lead frame with a thick metal plate, allowing heat generated by a semiconductor device mounted on the metal plate to be conducted to the metal plate side
Data Source
AI summary
The electrically insulating layer comprises a layer structure of a first adhesive sheet and a second adhesive sheet. The first adhesive sheet and the second adhesive sheet respectively have a first adhesive surface and a second adhesive surface as adhesive surfaces to each of which an adherend is adhered. The first adhesive sheet comprises: a sheet body composed of an adhesive resin composition having electrical insulation properties; and a different material sheet composed of a material different from the adhesive resin composition, having a smaller thickness than the sheet body and having a smaller area than the sheet body.