Non-Macromolecular Adhesive Additives TRIZ Cases

A high-Tg acrylic polymer, acid-free low-Tg polymer, and tackifier combine to keep thermoplastic olefin adhesion and cohesion stable over time.

A phosphite or phosphine oxygen inhibitor helps photocured acrylate adhesives keep adhesion and peel strength at high temperatures in flexible displays.

A polyester adhesive composition balances thin-film bonding strength with moisture-heat peelability, recyclability, and biodegradability for electronic members.

Low-density fillers cut adhesive weight and cost per square meter while preserving cohesion, stability, and bonding for flexible coverings.

Controlled acrylic polymer Mw and entanglement cut PSA residue without raising coating viscosity or sacrificing adhesion for surface protection.

An embedded different material sheet creates a flush adhesive surface that suppresses void-causing air entrapment in semiconductor insulation layers.

An embedded different-material sheet creates a flush adhesive interface that suppresses air entrapment and improves insulation reliability in semiconductor modules.

Cyclic acetal crosslinkers help formaldehyde resin adhesives cure at lower temperatures while reducing VOC emissions and extending shelf life.

A polyolefin hot-melt adhesive uses crystalline and amorphous resins with polypropylene wax to keep strong bonding while enabling easy mold release.

A TPU-based hot melt film uses matting agents and polyvinyl alcohol to cut gloss while preserving adhesion strength and tensile performance.

A silane-functional silicone composition improves adhesion on substrates such as PMMA while maintaining storage stability during curing.

Cyclohexylamine improves sulfonic acid and polyisocyanate compatibility, accelerating reaction while lowering turbidity and storage color change.

A peroxide and phenolic lipid curing system enables tack-free methacrylate bonding on passive surfaces and across large bond gaps.

A phenoxy alcohol disperses benzoyl peroxide in waterborne silicone PSA emulsions, enabling lower-cost curing with stable adhesion and low residue.

Fine calcium oxide in a tailored resin blend blocks water vapor while preserving transparency and suppressing yellowing in sealing layers.

A vinyl-reactive phosphorus compound improves resin flame retardancy while maintaining low dielectric tangent, heat resistance, and moisture durability.

A polyol-prepolymer curing system with carbamate compound (C) improves urethane adhesive toughness without sacrificing strength or handling.

Using o-vinylphenyl phosphorus compounds, this case improves flame retardancy, heat and hydrolysis resistance, and low dielectric loss in resin laminates.

A multi-resin epoxy adhesive maintains strong bonding from −40°C to 90°C and joins steel and aluminum with fewer welds.

Thin adhesive films gain fire retardancy from organophosphine oxide and organophosphinate particles without heavy metals or halogens.

Acrylic copolymer, organometallic, and isocyanate chemistry improves adhesive recovery, bonding durability, and folding stability.

pH-responsive nanospheres release acid scavengers inside EVA adhesive film to neutralize acetic acid and reduce PV module corrosion and delamination.

pH-responsive nanospheres release acid scavenger inside EVA film to neutralize acetic acid and protect photovoltaic module bonding and reliability.

Low-water sol-gel films improve steel adhesion and corrosion resistance while avoiding water entrapment near sensitive materials and crevices.

UV-crosslinkable PSA stays conformable during bonding, then gains deformation resistance to suppress outgassing bubbles and low-VOC odor.

Acrylic-epoxy adhesive tuning improves polyimide bonding and flexibility, helping flexible displays resist peeling and breakage during repeated folding.

A solvent-based epoxy primer with silane and core-shell rubber improves film uniformity, low-temperature peel strength, and corrosion resistance.

Semi-crystalline thermoplastic particles lower cure peak temperatures in expandable epoxy adhesives, enabling reliable large-gap automotive bonding.

A hybrid adhesive balances high thermal filler loading with fast cure and strong bonding to nickel-plated steel while preserving rigidity transfer.

An isobutene-based adhesive layer reduces thermal mismatch, limits folding bubbles, and preserves water vapor protection in flexible electronics.

A SEEPS and high-aniline-point oil blend keeps hot melt seals stable at high temperature while preserving adhesion and easy disassembly.

UV-tuned asymmetric adhesion helps optical films bond securely at first, then peel cleanly with less substrate damage and contamination.

A cross-linked acrylic adhesive film boosts peel strength while preventing glass scattering and preserving flexural reliability under thermal shock.

A composite OCA screen adhesive uses cobalt oxide, silicon nitride, and Er powder to absorb, filter, and convert harmful blue light.

A polyester adhesive with tailored acid units and crosslinking enables thin electronic tape with strong bonding, clean peeling, and recyclability.

Additives are introduced after curing so they diffuse into the adhesive layer, preserving adhesive strength while expanding functional design freedom.

A silane-cured polymer blend replaces epoxy and amine curing to improve workability, cut odor, and keep adhesion after alkaline treatment.

Nozzle-fed metal salts control hypophosphite flame retardant particle size, improving dispersibility, heat resistance, and thin adhesive use.

A TPU nail tip and antibacterial SIS-based adhesive layer improve retention while reducing nail damage, hygiene issues, and infection risk.

A dual-layer adhesive with low- and high-modulus sub-layers improves impact resistance while reducing external light reflection in flexible displays.

A water-soluble adhesive and plasticizer blend improves impact absorption and adhesion to reduce component damage and misalignment during transfer.

A multi-part adhesive composition uses reactive silicon polymers and epoxy curing chemistry to reach high stiffness after a short heating step.

A fluorinated adhesive underlayer boosts resist adhesion, suppresses fine pattern collapse, and maintains pattern profile in multilayer lithography.

Near-infrared reflective ink coatings create high contrast on ultrathin tapes, helping optical systems distinguish black components during assembly.

An ion-scavenging epoxy adhesive uses laser-driven heat curing to cut gas discharge and protect optical reflectance and transmittance.

UV-curable ink and primer formulations improve glass adhesion and optical density in thin opaque layers for automotive display cover glass.

A copolymer, free volume-increasing agent, and crosslinker keep foldable adhesive films easy to deform and stable in recovery from low to high temperatures.

A low-crystallinity polyurethane UV-curable adhesive film boosts initial tack, overlap strength, and drop resistance for small electronic bonding.

UV curing turns epoxidized plant oils or animal fats into pressure-sensitive adhesives with faster processing and sufficient cohesive strength.

Chemically bonded ROMP composite foam on metal substrates delivers low dielectric loss, water resistance, and thermal management for 5G materials.