Fluorinated Adhesive Film Material for Stable Multilayer Patterning
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Solution Overview
Problem
Existing photoresist compositions face challenges in achieving high adhesiveness to resist upper layer films, suppressing fine pattern collapse, and maintaining pattern profile integrity during the miniaturization of semiconductor manufacturing processes, particularly in multilayer resist methods.
Innovation Solution
A material for forming an adhesive film comprising a resin with fluorine-substituted organic sulfonyl anion structures, thermal acid generators, and organic solvents, which enhances adhesiveness to resist upper layer films and suppresses pattern collapse, while allowing for precise pattern transfer in multilayer resist processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the film thickness of the photoresist film is thinned to maintain resolution performance in fine patterning, then resolution performance is improved, but etching resistance is reduced
Solution Approach 1:
The photoresist system is divided into multiple functional layers: a thin upper-layer photoresist film for high-resolution patterning and a thicker adhesive film as underlayer for etching resistance. This segmentation allows each layer to optimize its thickness for its specific function without compromising the other.
Solution Approach 2:
The adhesive film is formulated as a composite material containing fluorinated polymer, acrylic acid, and crosslinking agent, combining multiple functional components to achieve both adhesion to the upper-layer resist and resistance to dry etching, while also providing mechanical support for thin pattern structures.
2Strength
If the film thickness of the photoresist film is increased to improve etching resistance, then etching resistance is improved, but resolution performance is lowered
Solution Approach 1:
The photoresist system is divided into multiple functional layers: a thin upper-layer photoresist film for high-resolution patterning and a thicker adhesive film as underlayer for etching resistance. This segmentation allows each layer to optimize its thickness for its specific function without compromising the other.
3Ease of operation
If the aspect ratio of the pattern is increased due to excessive pattern development, then pattern development is improved, but pattern collapse occurs
Solution Approach 1:
The adhesive film is applied beforehand to provide mechanical support and stabilization to the pattern structure. This pre-support prevents pattern collapse during development by reinforcing the walls of high aspect ratio patterns, allowing more aggressive development conditions to be used if needed.
Solution Approach 2:
The adhesive film is formulated as a composite material containing fluorinated polymer, acrylic acid, and crosslinking agent, combining multiple functional components to achieve both adhesion to the upper-layer resist and resistance to dry etching, while also providing mechanical support for thin pattern structures.
4Use of energy by moving object
If novolak resins and polyhydroxystyrene are used to reduce absorbance at shorter wavelengths, then exposure sensitivity is improved, but etching resistance is reduced
Solution Approach 1:
The photoresist system is divided into multiple functional layers: a thin upper-layer photoresist film for high-resolution patterning and a thicker adhesive film as underlayer for etching resistance. This segmentation allows each layer to optimize its thickness for its specific function without compromising the other.
Solution Approach 2:
The adhesive film is formulated as a composite material containing fluorinated polymer, acrylic acid, and crosslinking agent, combining multiple functional components to achieve both adhesion to the upper-layer resist and resistance to dry etching, while also providing mechanical support for thin pattern structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The material provides high adhesiveness to resist upper layer films, effectively suppresses fine pattern collapse, and enables precise pattern formation with improved profile control, suitable for multilayer resist processes such as the 4-layer resist process.
Implementation Method 1
a thermal acid generator
Data Source
Figure 1(A)~1(G)
Figure 2
AI summary
The present invention is a material for forming an adhesive film used for an adhesive film formed directly under a resist upper layer film, the material for forming an adhesive film containing: (A) a resin having at least one structural unit containing a fluorine-substituted organic sulfonyl anion structure and having at least one structural unit shown by the following general formula (2) besides the structural unit containing the fluorine-substituted organic sulfonyl anion structure; (B) a thermal acid generator; and (C) an organic solvent. This provides: a material for forming an adhesive film in a fine patterning process by a multilayer resist method in a semiconductor device manufacturing process, where the material gives an adhesive film that has high adhesiveness to a resist upper layer film, has an effect of suppressing fine pattern collapse, and that also makes it possible to form an excellent pattern profile; a patterning process using the material; and a method for forming the adhesive film.