Water-Soluble Adhesive Sheet for Precise Component Capture
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Solution Overview
Problem
Existing methods for transferring LED elements from a transfer source substrate to a target substrate often result in displacement, collision, and failure to place the elements at desired positions due to insufficient impact absorption and adhesiveness of the adhesive layer.
Innovation Solution
A water-soluble adhesive composition containing a water-soluble adhesive and a water-soluble plasticizer with specific viscosity and molecular weight ratios, enhancing impact absorption and adhesiveness, and a water-soluble adhesive sheet formed from this composition, which can be easily handled and removed with water.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional adhesive layer is used for transferring LED elements, then the transfer process can be performed, but the LED elements may be displaced or collide resulting in failure to place at desired positions
Solution Approach 1:
The patent changes the physical and chemical parameters of the adhesive by using a water-soluble adhesive with specific molecular weight (1,000 to 1,000,000) and adding a water-soluble plasticizer in a specific ratio (0.01 to 10 parts by mass per 1 part of adhesive). This parameter optimization improves both the impact absorption capability and the positioning precision during transfer
Solution Approach 2:
The patent creates a composite adhesive system by combining a water-soluble adhesive with a water-soluble plasticizer. This composite material provides both adequate adhesion for reliable transfer and improved impact absorption to prevent element displacement and collision damage
2Ease of operation
If the adhesive has high stickiness to capture components, then component capture is improved, but the adhesive may cause damage or misalignment during transfer
Solution Approach 1:
The patent applies beforehand cushioning by incorporating a water-soluble plasticizer into the adhesive composition before the transfer process. This plasticizer provides impact absorption capability in advance, cushioning against shocks during transfer and preventing element damage and misalignment while maintaining component capture ability
Solution Approach 2:
The patent optimizes the molecular weight of the water-soluble adhesive (1,000 to 1,000,000) and the ratio of plasticizer to adhesive (0.01 to 10 parts by mass per 1 part), creating an balanced adhesive system that provides adequate stickiness for component capture while minimizing damage and misalignment risks
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive composition and sheet improve the precision and efficiency of electronic component production by reducing damage and misalignment during transfer, allowing for stable attachment and easy removal of components.
Implementation Method 1
a water-soluble plasticizer having a viscosity of 50000 mPa·s or less at normal temperature (25° C.)
Implementation Method 2
improve impact absorption and the stickiness and adhesiveness of the water-soluble adhesive composition for component capture
Implementation Method 3
improve impact absorption and the stickiness and adhesiveness of the water-soluble adhesive composition for component capture
Data Source
AI summary
An object of the present invention is to provide a water-soluble adhesive composition for component capture and a water-soluble adhesive sheet for component capture which are superior in the impact absorption and the stickiness and adhesiveness and suitable for capturing components, and provide a method which allows high-precision, efficient production of electronic components, by using the composition and the sheet. To achieve the object, a composition and a sheet including the composition are provided, the composition containing an (A) water-soluble adhesive and a (B) water-soluble plasticizer (excluding the component (A)), wherein the (B) water-soluble plasticizer has 50000 mPa·s or less at normal temperature (25° C.), and a ratio of a content of the (B) water-soluble plasticizer to a content of the (A) water-soluble adhesive ((B)/(A)) is greater than 0.5 and 3.0 or less. According to the present invention, impact absorption and the stickiness and adhesiveness are improved, and particularly in the production of a semiconductor element, damage or misalignment of a component (element) is reduced. Particularly the sheet of the present invention is easy to handle in attachment and peeling.


