Embedded Bridge Interposer for High-Density Chip Interconnects
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Solution Overview
Problem
Current semiconductor packaging technologies, such as Intel's EMIB, require a flat surface for embedding bridges in organic substrates, which complicates flip-chip packaging and affects structural reliability and interconnect density.
Innovation Solution
A package structure with a bridge, interposer, and redistribution layers, where the bridge is embedded in the interposer with aligned bridge pads, enabling better flatness and electrical connections between chips for high-density interconnects, and a manufacturing method that includes forming redistribution layers and embedding the bridge within the interposer to achieve these connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a bridge is embedded in an organic substrate through lamination technology, then electrical connection between chips is achieved, but the surface must be flat which complicates the manufacturing process and affects structural reliability
Solution Approach 1:
The bridge is embedded in the interposer before the organic substrate is formed, allowing the interposer to provide mechanical support and electrical interconnection in advance. This preliminary embedding action enables subsequent flip-chip packaging without requiring the bridge to be embedded through complex lamination processes, thereby simplifying the manufacturing process while maintaining structural reliability
Solution Approach 2:
The interposer serves as an intermediary component between the bridge and the organic substrate. It provides a stable platform for bridge embedding and electrical interconnection, eliminating the need for complex lamination technology to achieve flat surfaces. The interposer mediates the connection between different components, simplifying the overall manufacturing process while ensuring structural integrity
2Reliability
If a bridge is embedded in an organic substrate, then electrical connection between chips is achieved, but the surface flatness requirement affects flip-chip packaging
Solution Approach 1:
The bridge is embedded in the interposer before the organic substrate is formed, allowing the interposer to provide mechanical support and electrical interconnection in advance. This preliminary embedding action enables subsequent flip-chip packaging without requiring the bridge to be embedded through complex lamination processes, thereby simplifying the manufacturing process while maintaining structural reliability
Solution Approach 2:
The interposer serves as an intermediary component between the bridge and the organic substrate. It provides a stable platform for bridge embedding and electrical interconnection, eliminating the need for complex lamination technology to achieve flat surfaces. The interposer mediates the connection between different components, simplifying the overall manufacturing process while ensuring structural integrity
Data Source
AI summary
A package structure, including a bridge, an interposer, a first redistribution structure layer, a second redistribution structure layer, and multiple chips, is provided. The bridge includes a silicon substrate, a redistribution layer, and multiple bridge pads. The interposer includes an intermediate layer, multiple conductive vias, multiple first pads, and multiple second pads. The bridge is embedded in the intermediate layer. The bridge pads are aligned with the upper surface. The first redistribution structure layer is disposed on the upper surface of the interposer and is electrically connected to the first pads and the bridge pads. The second redistribution structure layer is disposed on the lower surface of the interposer and is electrically connected to the second pads. The chips are disposed on the first redistribution structure layer and are electrically connected to the first redistribution structure layer. The chips are electrically connected to each other through the bridge.