Embedded Component Carrier Heat Removal Architecture
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Solution Overview
Problem
Conventional component carriers face challenges in heat dissipation, leading to performance and reliability issues due to inadequate heat management, especially as electronic components generate heat during operation.
Innovation Solution
A component carrier design incorporating a heat removal body with a component-sided thermally conductive structure and an exterior structure, connected via a patterned adhesive sheet, to efficiently dissipate heat from embedded components to the exterior surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heat dissipation approaches are used in embedded components, then the component carrier can be manufactured simply, but heat removal efficiency deteriorates leading to performance and reliability issues
Solution Approach 1:
The heat removal body is divided into multiple functional structures: a first heat removal structure thermally coupled to the embedded component for direct heat extraction, a second heat removal structure for dissipating heat to the exterior, and an adhesive sheet for mechanical bonding. This segmentation allows each structure to be optimized for its specific thermal function, improving overall heat removal efficiency while maintaining manufacturing simplicity
Solution Approach 2:
The adhesive sheet serves as a thermal intermediary between the first and second heat removal structures. It provides both mechanical adhesion and thermal conduction pathways, enabling efficient heat transfer from the component-facing structure to the exterior-facing structure while maintaining structural integrity of the component carrier
2Adaptability or versatility
If embedded components are used to increase functionality, then product functionality improves, but heat generation increases leading to thermal management challenges
Solution Approach 1:
The heat removal body extracts heat from the embedded component through the first heat removal structure that is thermally coupled to the component. This extraction approach removes the harmful thermal byproduct of high-functionality components before it can accumulate and degrade performance or reliability
Solution Approach 2:
The heat removal architecture extends heat dissipation into the vertical dimension by using stacked heat removal structures with different orientations - the first structure faces the embedded component while the second structure faces the exterior surface. This multi-dimensional thermal pathway enables efficient heat removal without compromising the horizontal integration of multiple high-functionality components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances thermal performance and reliability by ensuring effective heat removal and distribution, maintaining high performance and mechanical robustness even under harsh conditions.
Implementation Method 1
a heat removal body configured for removing heat from the component and being connected to the stack, the heat removal body comprising a component-sided first heat removal structure thermally coupled with the component, and a second heat removal structure thermally coupled with the first heat removal structure
Data Source
AI summary
A component carrier including a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure. A component embedded in the stack, and a heat removal body configured for removing heat from the component is connected to the stack and preferably to the component. The heat removal body including a component-sided first heat removal structure thermally coupled with the component, and a second heat removal structure thermally coupled with the first heat removal structure and facing away from the component.