Printed Circuit Aspects TRIZ Cases

Granular filler and an LCP matrix cut melt viscosity without additives, enabling thin molded parts with heat resistance and no blistering.

Z-axis compression connectors stack cDIMMs above the PCB to cut trace crossings, simplify routing, and support higher memory data rates.

Z-axis compression connectors stack cDIMMs to raise memory capacity while easing PCB congestion, lowering power use, and supporting faster routing.

A dual-PCB charging path with a switchable second charging IC shortens the fast-charge route to cut resistance, power loss, and heat.

A profiled screen prints busbars and fingers onto still-wet solar cell patterns, enabling joint curing with fewer stations and less line footprint.

By nesting the output capacitor inside the converter module, this case cuts parasitics and preserves dynamic performance in vertical VRM layouts.

A raised corner conductor reinforces package corners as conductor area shrinks, improving joining strength and reducing chipping and cracking.

A resin-particle insulating layer with asymmetric metal coverage suppresses warpage while preserving low dielectric loss and antenna performance.

Injected refrigerant evaporates on ribbed heat-transfer surfaces and condenses efficiently to cool MIMO antenna electronics without added bulk.

Oblique connection wirings keep a wound motor coil substrate circular, avoiding magnet interference and improving heat dissipation.

A 6-8 mass% nickel-phosphorus layer cuts high-frequency loss above 8 GHz while improving eye opening and antenna gain.

Forming PCB apertures after winding layout cuts alignment tolerances, enabling larger core legs, wider traces, and lower planar transformer losses.

Grounded connecting conductors in a PCB-FPC high-frequency interconnect suppress electric field leakage and crosstalk for cleaner signal transmission.

Direct PCB pin connections replace wire harnesses in high-voltage power distribution units, cutting mass, space, assembly complexity, and failure points.

Interconnected back-drilled vias and local microvias ease fine-pitch mmWave PCB routing while lowering phased array antenna fabrication cost.

Paired PCB vias detect humidity across multiple zones, enabling earlier corrosion warning and current cutoff when hydrolysis risk rises.

Matching the clad busbar expansion to the insulating member cuts thermal stress at component bonds and improves circuit durability.

A shared heat dissipator cools side-by-side components of different heights using overlapping front surfaces and a substrate gap to stabilize operation.

A two-stage heat removal body with a patterned adhesive sheet conducts heat from embedded components to the carrier exterior for better reliability.

Separated mounting regions, metal posts, and pad routing improve surface flatness and connection reliability under thermal expansion.

A grooved deformable section lets the sampling terminal move with battery cell expansion, preventing detachment and preserving voltage and temperature data.

Wider end wiring and controlled copper-layer void density help prevent conductive pattern peeling during PCB etching.

Interchangeable heatsink pedestals cool beamforming ICs across mmWave bands while suppressing gap propagation and reducing tooling changes.

Direct chip-to-board contact with a conducting medium and non-conducting adhesive cuts signal loss, lowers bonding temperature, and shrinks camera modules.

Axially interrupted coated electrode segments cut bushing capacitance, enabling direct voltage, temperature, and partial discharge measurement.