Electronic Component Package Corner Conductor for Crack Resistance

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Solution Overview

Problem

As electronic component housing packages become smaller, the reduced area of external connection conductors on the lower surface leads to a potential decrease in joining strength between the insulating substrate and the external connection conductor, increasing the likelihood of chipping and cracking, especially at the corner portions, which can result in reduced reliability and disconnection risks.

Innovation Solution

The electronic component housing package incorporates a corner conductor that increases in distance from the second surface towards the corner portion between the side surfaces, sandwiching the corner portion between the external connection conductor and the corner conductor to enhance the substrate's strength, and includes an insulator between these conductors to absorb stress and prevent chipping and cracking.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the electronic component housing package is miniaturized, then the size of the package is reduced, but the joining strength between the insulating substrate and the external connection conductor decreases

Engineering Contradiction:
Improvepackage sizeVSAvoidjoining strength
Core Design Contradiction:
Volume of moving objectVSStrength

Solution Approach 1:

The patent applies local quality by making the corner conductor protrude more than the external connection conductor at the corner portions of the insulating substrate. This localized structural differentiation reinforces the corner areas where chipping and cracking are most likely to occur during miniaturization, thereby maintaining joining strength without increasing overall package size.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent utilizes the vertical dimension by having the corner conductor protrude in the thickness direction beyond the external connection conductor. This dimensional approach allows the corner portion to be reinforced in three-dimensional space, providing additional structural support and stress distribution that prevents joining strength degradation during miniaturization.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Area of stationary object

If the external connection conductor area is reduced, then the package size is reduced, but the likelihood of chipping and cracking increases

Engineering Contradiction:
Improveexternal connection conductor areaVSAvoidresistance to chipping and cracking
Core Design Contradiction:
Area of stationary objectVSReliability

Solution Approach 1:

The patent implements local quality by providing enhanced reinforcement specifically at the corner portions where the corner conductor protrudes beyond the external connection conductor. This localized structural enhancement targets the areas most susceptible to chipping and cracking, allowing the overall external connection conductor area to be reduced while maintaining reliability at critical stress points.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The protruding corner conductor acts as a beforehand cushioning structure that preemptively protects the corner portions of the insulating substrate. By having this reinforcement in place before any chipping or cracking can occur, the structure prevents damage propagation and maintains electrical connection reliability even when the overall conductor area is minimized.

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

3Strength

If the corner portion is reinforced, then the joining strength is increased, but the device complexity increases

Engineering Contradiction:
Improvejoining strengthVSAvoidconductor configuration complexity
Core Design Contradiction:
StrengthVSDevice complexity

Solution Approach 1:

The patent resolves the complexity issue by applying reinforcement only locally at the corner portions rather than uniformly across the entire external connection conductor. The corner conductor is configured to protrude only at these specific locations, providing necessary strength enhancement while keeping the overall device structure simple and the manufacturing process straightforward.

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS12177983B2Electronic component housing package, electronic device, and electronic module
Publication Date: 2024.12.24 KYOCERA CORP
  • US12177983B2 patent drawing
  • US12177983B2 patent drawing
  • US12177983B2 patent drawing

AI summary

An electronic component housing package includes an insulating substrate including a first surface with a mounting region mounting an electronic component, a second surface located opposite to the first surface, a plurality of side surfaces located between the first surface and the second surface, and a corner portion located between two of the side surfaces; an external connection conductor located on the second surface; and a corner conductor connected to the external connection conductor. The corner conductor is located from the external connection conductor toward the corner portion in a manner to increase the distance from the second surface.