Segmented Wiring Substrate Layout for Flat, Reliable Chip Mounting
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing wiring substrates face challenges in achieving high connection reliability and flexibility in mounting electronic components due to large dimensions and potential thermal expansion issues, which can lead to connection failures and reduced flatness of the component mounting surface.
Innovation Solution
A wiring substrate design featuring a first insulating layer, conductor layers with specific pad configurations, metal posts filling openings in a second insulating layer, and a wiring structure with surface connection pads that form a component mounting surface across multiple regions, allowing for efficient electronic component connection and reduced wiring structure dimension in the planar direction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the wiring substrate uses a large dimension organic wiring substrate to mount multiple semiconductor chips, then the mounting flexibility and connection capacity are improved, but the thermal expansion issues increase leading to connection failures and reduced flatness
Solution Approach 1:
The patent divides the component mounting surface into multiple independent component mounting regions (first, second, and third regions) that are spatially separated. Each region can accommodate different electronic components independently, allowing flexible mounting configurations while isolating thermal expansion effects to localized areas rather than affecting the entire substrate, thus maintaining connection reliability.
2Adaptability or versatility
If the wiring structure dimension in the planar direction is increased to accommodate more connection pads, then the circuit design freedom is improved, but the flatness of the component mounting surface deteriorates
Solution Approach 1:
The patent transitions from a single-planar arrangement of connection pads to a three-dimensional distributed structure where connection pads are arranged across multiple component mounting regions at different spatial locations. This dimensional distribution allows the wiring structure to accommodate more connection pads and greater circuit design freedom while maintaining local flatness in each region, as the regions are separated rather than continuously extended in one plane.
3Quantity of substance
If the wiring substrate accommodates multiple electronic components in close proximity, then the integration density is improved, but the thermal expansion influence increases causing connection failures
Solution Approach 1:
The patent segments the component mounting surface into multiple distinct component mounting regions that are spatially separated. This segmentation allows multiple electronic components to be mounted across different regions, achieving high integration density while the separation between regions isolates thermal expansion effects, preventing them from propagating across the entire substrate and causing connection failures.
Solution Approach 2:
The patent introduces insulating layers as intermediary structures between different component mounting regions and between the conductor pads and metal posts. These insulating layers act as thermal barriers that reduce thermal expansion influence while allowing electrical connections to be established, thus enabling high integration density without compromising connection reliability under thermal stress.
Data Source
AI summary
A wiring substrate includes a first insulating layer, a conductor layer including first and second pads, a second insulating layer having first openings exposing the first pads and a second opening exposing the second pads, metal posts formed on the first pads and filling the first openings, and a wiring structure positioned in the second opening and having first and second connection pads such that the second connection pads are connected to the second pads. The upper surfaces of the first connection pads and the upper surfaces of the metal posts form a component mounting surface having first, second and third regions, the first connection pads are formed in the first, second and third regions and include a group of first connection pads formed in the first and second regions and electrically connected and a group of first connection pads formed in the first and third regions and electrically connected.