Shared Heat Dissipator Layout for Uneven Electronic Components
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Solution Overview
Problem
Conventional electronic devices, such as IPMs, face challenges in heat dissipation, leading to unstable operation due to generated heat, which is a common issue across various electronic components.
Innovation Solution
The electronic device configuration includes a first and second electronic component mounted on a substrate with a heat dissipator, where the components' dimensions and positioning allow for improved heat dissipation by overlapping front surfaces and maintaining a gap between the second component's back surface and the substrate, enabling a common heat dissipator to be attached effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a common heat dissipator is attached to multiple electronic components with different dimensions, then heat dissipation is improved and device complexity is reduced, but manufacturing precision requirements increase due to the need to maintain proper spacing and alignment
Solution Approach 1:
The patent combines multiple heat dissipation functions into a single common heat dissipator that serves multiple electronic components simultaneously. This reduces the total number of heat dissipators needed and simplifies the overall device structure while maintaining effective heat dissipation for each component through proper spacing arrangement
Solution Approach 2:
The patent employs asymmetric spacing arrangements where different gaps are intentionally created between the common heat dissipator and different electronic components. This asymmetric design allows optimization of heat dissipation for each specific component while maintaining a unified heat dissipator structure, balancing manufacturing simplicity with thermal performance requirements
2Adaptability or versatility
If electronic components are arranged with different dimensions in the thickness direction, then adaptability and space utilization are improved, but device complexity increases due to the need for gap management and alignment
Solution Approach 1:
The patent creates a universal mounting structure that can accommodate electronic components of different dimensions. The common heat dissipator serves as a universal thermal management solution for multiple components, while the standardized gap management approach provides a multi-functional framework that handles both mechanical support and thermal dissipation for diverse component configurations
Solution Approach 2:
The patent manages dimensional variations by utilizing the spacing dimension (gap) between components and the common heat dissipator. By controlling distances in the thickness direction rather than trying to make components uniform in size, the design achieves adaptability for different component dimensions while maintaining structural simplicity through standardized spacing relationships
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat dissipation from both electronic components, simplifies manufacturing and maintenance by eliminating steps between components, and prevents terminal bending, thereby stabilizing the device's operation.
Implementation Method 1
a heat dissipator having an attaching surface to which the first electronic component and the second electronic component are attached
Data Source
AI summary
An electronic device includes a first electronic component including a first main body, a second electronic component including a second main body, a mounting substrate having a mounting surface, and a heat dissipator having an attaching surface. The mounting surface and the attaching surface face each other in the z direction. The first main body and the second main body are disposed between the mounting substrate and the heat dissipator in the z direction and arranged side by side in the x direction. The first main body has a first front surface facing the attaching surface and a first back surface facing the mounting surface. The second main body has a second front surface facing the attaching surface and a second back surface facing the mounting surface. The dimension of the second main body in the z direction is smaller than the dimension of the first main body in the z direction. The first front surface and the second front surface overlap with each other as viewed in the x direction. A gap is provided between the second back surface and the mounting surface.