Integrated Power Converter Module With Nested Output Capacitor
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In high-current, low-voltage applications like data centers and AI systems, traditional VRM modules face challenges in efficiency, transient response, and power density due to increased load currents and heat dissipation issues, particularly in vertical power supply modes where space for output capacitors is limited, affecting dynamic performance.
Innovation Solution
An integrated power converter module with an output capacitor integrated within the module, optimized parasitic parameters, and a layered capacitor design to reduce height and enhance reliability, allowing for improved dynamic performance and power density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If the VRM module and load CPU are vertically stacked to reduce PDN impedance, then efficiency is improved, but there is no space to arrange the output capacitor, seriously influencing dynamic performance
Solution Approach 1:
The patent transitions from horizontal arrangement to vertical stacking of VRM module and load CPU, reducing PDN impedance and improving efficiency. Simultaneously, it integrates the output capacitor within the VRM module's vertical structure by utilizing the space between the magnetic core and the printed circuit board, ensuring dynamic performance is maintained without compromising the vertical arrangement benefits.
Solution Approach 2:
The output capacitor is nested within the VRM module structure, specifically positioned in the space between the magnetic core and the printed circuit board. This nested integration allows the capacitor to be included in the vertical stack without increasing the overall footprint, thereby maintaining both efficiency improvement and dynamic performance.
2Reliability
If the output capacitor is integrated in the VRM module, then dynamic performance is improved, but the module height increases
Solution Approach 1:
Instead of increasing module height vertically, the patent integrates the output capacitor in the horizontal plane between the magnetic core and the printed circuit board. This dimensional reorganization allows capacitor integration without significantly increasing the overall module height, maintaining compact form factor while improving dynamic performance.
Solution Approach 2:
The patent creates a localized capacitor setting area between the magnetic core and the printed circuit board, utilizing otherwise wasted space. This local integration approach allows the output capacitor to be positioned optimally for dynamic performance without affecting the overall module dimensions.
3Temperature
If the VRM module shares the radiator with the load ASIC, then thermal resistance is reduced, but the circuit layout becomes complex, requiring integration of power and signal connectors
Solution Approach 1:
The bottom surface of the VRM module is designed to serve dual functions: as a mounting surface for the load ASIC with shared radiator for thermal management, and as an electrical connection interface through integrated power and signal connectors. This multi-functional design simplifies the overall system layout by combining thermal and electrical connection functions in one interface.
Data Source
AI summary
An integrated assembly and an integrated power converter module are disclosed. The integrated assembly includes an inductor assembly and a first capacitor assembly. The top surface of the integrated assembly is provided with an upper surface pin, and the bottom surface is provided with a lower surface pin; the inductor assembly includes a magnetic core and a main winding penetrating through the magnetic core from the top surface to the bottom surface thereof, the main winding is electrically connected with the upper and the lower surface pins, the surface of the magnetic core is provided with a capacitor setting area where the first capacitor assembly is arranged; the bottom surface of the electrode of the first capacitor assembly and the pin of the lower surface of the inductor assembly are coplanar, and the top surface of the first capacitor assembly and the surface of the magnetic core are electrically isolated.