Embedded Ceramic Camera Module Packaging for Compact High Resolution
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Solution Overview
Problem
Conventional camera technologies in small form factor devices, such as smartphones, struggle to capture high-resolution images due to limitations in pixel size and imaging lens systems, requiring compact and high-performance components while maintaining a compact module height.
Innovation Solution
The integration of an embedded ceramic substrate package with a ceramic substrate embedded in layers, including a bulk molding compound and a redistribution layer, attached to an image sensor, which provides improved mechanical stability, thermal performance, and signal integrity, enabling higher resolution and compact camera modules.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional camera technology is used in small form factor devices, then the module size is compact, but the image resolution and quality are limited
Solution Approach 1:
The patent embeds the ceramic substrate containing the imaging lens system within the image sensor package structure. The ceramic substrate is positioned in a cavity formed in the image sensor package, creating a nested configuration where the lens system is housed inside the sensor package volume. This nesting approach allows high-resolution imaging components to be integrated within a compact module footprint, resolving the contradiction between image resolution and module size.
Solution Approach 2:
The patent transitions from a planar two-dimensional package layout to a three-dimensional vertical stacking architecture. The imaging lens system is positioned at a different vertical level (Z-axis) relative to the image sensor, with the lens focal point aligned to the sensor surface. This dimensional change enables compact integration while maintaining optical performance, as components are arranged in the vertical dimension rather than requiring lateral space.
2Manufacturing precision
If the pixel size is reduced to achieve higher resolution, then the image resolution improves, but the mechanical stability and thermal performance deteriorate
Solution Approach 1:
The patent employs a ceramic substrate material that combines multiple desirable properties: mechanical strength, thermal stability, and electrical insulation. The ceramic material provides a rigid, stable foundation for the imaging lens system while maintaining dimensional stability under thermal variations. This composite approach (ceramic substrate integrating structural and functional properties) supports high-resolution pixel arrays without compromising mechanical stability, resolving the contradiction between pixel resolution and mechanical stability.
3Length of stationary object
If the module height is reduced for compactness, then the form factor is smaller, but the imaging quality and brightness performance worsen
Solution Approach 1:
The patent incorporates an adjustable aperture mechanism within the imaging lens system that can dynamically control the light transmission area. The aperture can be adjusted to optimize brightness performance under different lighting conditions while maintaining a compact module height. This dynamic adjustment capability allows the system to achieve high image brightness without increasing the physical module dimensions, resolving the contradiction between module height and image brightness.
Data Source
AI summary
An embedded ceramic substrate package includes a ceramic substrate embedded in one or more layers. The one or more layers include at least a bulk molding compound (BMC) and a redistribution layer (RDL). At least a portion of the one or more layers includes electrical signal trace routing. The embedded ceramic substrate package is attached to an image sensor that is configured to capture light projected onto a surface of the image sensor.