Embedded Ceramic Capacitors in Wiring Boards for Multi-Processor Power
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Solution Overview
Problem
The existing wiring boards face challenges in connecting multiple semiconductor integrated circuit elements due to size constraints, thermal expansion mismatch, and the need for individual power supply systems, which limits the realization of multi-microprocessor systems and increases heat stress.
Innovation Solution
A wiring board design featuring a substrate core with embedded ceramic capacitors and a built-up layer with alternating insulating and conductor layers, allowing for efficient electrical connections and thermal expansion matching, enabling multiple semiconductor elements to be mounted without enlarging the board size and providing individual power supply systems.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a shared power supply system is used to reduce board size, then the number of ceramic capacitors can be reduced, but each microprocessor cannot be fully operational
Solution Approach 1:
The patent applies segmentation by dividing the power supply system into separate, independent units. Each microprocessor is associated with its own dedicated ceramic capacitor for power supply, rather than using a shared power supply. This segmentation ensures that each microprocessor can be fully operational independently, while the vertical stacking maintains compact board size.
Solution Approach 2:
The patent implements local quality by providing customized, location-specific power supply capabilities. Each mounting area for microprocessors has its own dedicated ceramic capacitor with appropriate capacitance values tailored to the specific power requirements of each microprocessor. This localized approach ensures optimal operational capability for each processor while maintaining overall system compactness.
2Reliability
If the thermal expansion coefficients of the microprocessor and wiring board do not match, then heat stress increases causing cracking and faulty connections
Solution Approach 1:
The patent applies the intermediary principle by introducing ceramic capacitors as intermediate elements between the microprocessors and the substrate core. These ceramic capacitors serve as thermal expansion buffers that can accommodate differential expansion between the microprocessor and the polymer-based substrate. The ceramic material's thermal expansion properties act as a mediator to reduce stress transmission to the microprocessor connections.
Solution Approach 2:
The patent utilizes composite materials by combining ceramic capacitor housings with polymer-based substrate cores. The ceramic material provides thermal stability and matched thermal expansion properties, while the polymer substrate provides mechanical flexibility and ease of manufacturing. This composite structure creates a thermal expansion gradient that protects the microprocessor from excessive heat stress.
Data Source
AI summary
A wiring board includes a substrate core, ceramic capacitors and a built-up layer. The substrate core has a housing opening portion therein which opens at a core main surface. The ceramic capacitors are accommodated in the housing opening portion and oriented such that the core main surface and a capacitor main surface of each capacitor face the same way. The built-up layer includes semiconductor integrated circuit element mounting areas at various locations on a surface thereof. In the substrate core, each ceramic capacitor is respectively disposed in an area corresponding to each semiconductor integrated circuit element mounting area.