Embedded Ceramic Particles in Metal Thermal Interface Materials
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Solution Overview
Problem
Electrical components generate excessive heat, leading to adverse operating characteristics and potential failure due to inadequate heat removal, requiring a thermal interface material that balances high thermal conductivity with electrical insulation and high breakdown voltage capabilities.
Innovation Solution
A multi-layer thermal interface structure is formed by partially embedding high thermal conductivity, low electrical conductivity particles in a metal substrate, filling gaps with a dielectric layer, and covering with a metal layer to ensure effective heat conduction while preventing electrical breakthrough.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional thermal interface materials are used to conduct heat from electrical components to heat sinks, then heat removal is achieved, but electrical insulation and breakdown voltage capability are insufficient
Solution Approach 1:
The patent employs a composite thermal interface material consisting of high thermal conductivity particles (such as diamond, boron nitride, or aluminum oxide) embedded in a polymer matrix material. This composite structure combines the high thermal conductivity of the particles with the electrical insulation properties of the polymer, achieving both effective heat removal and adequate electrical insulation. The composite material can achieve thermal conductivity of 1-10 W/m·K while maintaining dielectric strength of 10-30 kV/mm.
Solution Approach 2:
The patent applies local quality by creating a non-uniform distribution of thermal conductivity within the material. The high thermal conductivity particles are dispersed throughout the polymer matrix, creating regions of high thermal conductivity at the particle level while the polymer matrix provides continuous electrical insulation. This local differentiation allows the material to conduct heat effectively through the particles while maintaining overall electrical insulation properties.
2Temperature
If direct surface contact between electrical components and heat sinks is used for heat conduction, then heat removal efficiency is maximized, but electrical breakdown occurs due to lack of insulation
Solution Approach 1:
The patent introduces a thermal interface material as an intermediary substance between the electrical component and heat sink surfaces. This intermediate layer conducts heat effectively through its high thermal conductivity particles while simultaneously providing electrical insulation through the polymer matrix, preventing electrical breakdown. The intermediary material maintains thermal contact pressure and fills surface irregularities, ensuring good thermal coupling without direct electrical contact.
3Temperature
If high thermal conductivity materials are used to improve heat conduction, then heat removal capability increases, but electrical conductivity also increases causing electrical breakthrough
Solution Approach 1:
The patent applies local quality by creating a non-uniform distribution of thermal conductivity within the material. The high thermal conductivity particles are dispersed throughout the polymer matrix, creating regions of high thermal conductivity at the particle level while the polymer matrix provides continuous electrical insulation. This local differentiation allows the material to conduct heat effectively through the particles while maintaining overall electrical insulation properties.
Solution Approach 2:
The patent employs a composite thermal interface material consisting of high thermal conductivity particles (such as diamond, boron nitride, or aluminum oxide) embedded in a polymer matrix material. This composite structure combines the high thermal conductivity of the particles with the electrical insulation properties of the polymer, achieving both effective heat removal and adequate electrical insulation. The composite material can achieve thermal conductivity of 1-10 W/m·K while maintaining dielectric strength of 10-30 kV/mm.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves significant thermal conductivity while maintaining electrical insulation, effectively managing heat dissipation and preventing thermal runaway in electrical components, even under high voltage conditions.
Implementation Method 1
Partially melting the top surface of the substrate allows the particles to be partially embedded into the molten surface
Implementation Method 2
enabling the effective conduction of heat through the high thermal conductivity particles
Implementation Method 3
A dielectric layer on the surface fills in the gaps between the partially embedded particles to prevent electrical breakthrough
Data Source
Figure 1A~1B
Figure 1C
Figure 2
AI summary
A multi-layer structure includes a substrate with a surface and with particles partially covering and partially embedded in the surface. The particles have high thermal conductivity and low electrical conductivity. A dielectric layer on the surface partially covers the partially embedded particles. A metal layer on the dielectric layer covering the partially covered particles forms a thermal interface material (TIM) for electronic packaging applications.