Embedded Chip Carrier With Electroplated Metal Layer
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Solution Overview
Problem
Existing chip carrier structures face issues with moisture intrusion, leading to delamination and oxidation of circuits, limited heat dissipation, and inefficient space utilization due to the loose morphology of moisture barriers and encapsulating materials.
Innovation Solution
A chip carrier structure with a semiconductor chip embedded and a protective metal layer formed on its bottom and side surfaces through electroplating, using materials like copper, gold, nickel, and palladium, which also includes a conductive layer for enhanced heat dissipation and electromagnetic interference shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a moisture barrier is formed using sol-gel or coating technique, then the moisture barrier covers the encapsulating material and circuit build up structure, but the morphology is loose and moisture can still permeate into the structural layers
Solution Approach 1:
The patent changes the physical and chemical parameters of the moisture barrier by using electroplating to form a metal layer with high density and crystalline structure, transforming the barrier from a loose coating morphology to a dense metallic structure that effectively blocks moisture permeation while maintaining coverage
Solution Approach 2:
The patent creates a composite protective structure by combining the encapsulating material, circuit build up structure, and electroplated metal layer into a multi-layer composite system, where each layer contributes different properties (encapsulation, circuit functionality, and moisture barrier) to achieve overall protection
2Device complexity
If the side surfaces of the encapsulating material and circuit build up structure are not protected, then the structure is simpler, but moisture and contaminations can enter between layers causing delamination or oxidation
Solution Approach 1:
The patent segments the protective coverage into distinct regions: the encapsulating material top surface, the circuit build up structure surfaces, and the side surfaces, applying the electroplated metal layer to each segment to ensure comprehensive protection without creating a monolithic complex structure
Solution Approach 2:
The patent extends the protective metal layer from the traditional two-dimensional top surface coverage to three-dimensional coverage that includes vertical side surfaces, adding a dimensional aspect to the protection that prevents moisture ingress from lateral directions
3Volume of moving object
If the microelectronic die is completely embedded in the encapsulating material, then the structure is compact, but heat cannot be easily dissipated outside
Solution Approach 1:
The patent introduces the electroplated metal layer as an intermediary between the embedded microelectronic die and the external environment, where the metal layer serves as a thermal conduction pathway that facilitates heat transfer from the die through the encapsulating material to the outside, resolving the heat dissipation issue while maintaining compact embedding
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The dense metal layer effectively prevents moisture intrusion, reduces the risk of delamination and oxidation, enhances heat dissipation, and improves electrical performance by utilizing the chip carrier's space more efficiently.
Implementation Method 1
a metal layer electroplated on the bottom surface and side surfaces of the chip carrier
Implementation Method 2
a conductive layer formed between the chip carrier and the metal layer
Data Source
AI summary
The present invention provides a chip carrier structure having a semiconductor chip embedded therein and a protective metal layer formed thereon and a fabrication method thereof. The chip carrier structure includes a chip-embedded carrier structure, and a metal layer formed by electroplating on the bottom surface and side surfaces of the chip-embedded carrier structure. The metal layer prevents moisture from crossing the side surfaces of the chip-embedded carrier structure, so as to prevent delamination, provide a shielding effect, and improve heat dissipation through the metal layer.