Embedded Photosensitive Chip Circuit Board Assembly
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Solution Overview
Problem
The miniaturization of camera modules is hindered by the need to widen the circuit board to accommodate altered conductive lines resulting from the embedding of photosensitive chips, which increases the overall height of the camera module.
Innovation Solution
A circuit board assembly that includes a reinforced plate with connecting lines that intercept and connect to the conductive lines, allowing the photosensitive chip to be embedded within a through hole without requiring an increase in the circuit board's sideways dimension, thus maintaining a minimal height for the camera module.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the photosensitive chip is embedded in the circuit board to reduce overall height, then the height of the camera module is reduced, but the circuit board needs to become wider to accommodate altered conductive lines
Solution Approach 1:
The patent introduces a reinforced plate positioned beneath the circuit board to provide structural support in the vertical dimension, enabling the circuit board to maintain its original width without requiring horizontal expansion. This dimensional shift allows the photosensitive chip to be embedded without increasing the circuit board's sideways dimension.
Solution Approach 2:
The reinforced plate acts as an intermediary structure between the circuit board and the mounting surface, bearing the mechanical stress and structural requirements that would otherwise require the circuit board itself to be larger and stronger. This mediator allows the circuit board to remain compact while still supporting the embedded photosensitive chip.
2Ease of manufacture
If the opening is made larger to accommodate the photosensitive chip, then the chip can be properly embedded, but the conductive lines need to be redistributed requiring increased circuit board width
Solution Approach 1:
The patent segments the structural support function from the electrical connection function by introducing a separate reinforced plate. This allows the opening in the circuit board to be optimized for photosensitive chip embedding without compromising the structural integrity or requiring redistribution of conductive lines, as the reinforced plate handles the mechanical support independently.
Solution Approach 2:
The reinforced plate serves as an intermediary that handles the mechanical and structural requirements, allowing the circuit board's conductive lines to maintain their original distribution while still accommodating a properly sized opening for the photosensitive chip.
3Reliability
If the circuit board width is increased to adapt to altered conductive lines, then proper electrical connection is maintained, but the miniaturization of the camera module is hindered
Solution Approach 1:
The reinforced plate provides structural support in the vertical dimension beneath the circuit board, eliminating the need for horizontal expansion. This allows the circuit board to maintain its original width and conductive line distribution while still supporting the embedded photosensitive chip, thereby maintaining electrical connectivity without increasing overall module size.
Solution Approach 2:
By separating the structural support function (handled by the reinforced plate) from the electrical connection function (handled by the circuit board's conductive lines), the patent allows the conductive lines to maintain their original distribution without requiring circuit board expansion, thus preserving both reliability and compactness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for the miniaturization of camera modules by maintaining the original dimensions of the circuit board, ensuring a minimal height and efficient electrical connectivity without compromising the distribution of conductive lines.
Implementation Method 1
the photosensitive chip is electrically connected to the circuit board through wire bonding
Data Source
AI summary
A circuit board assembly with a fully embedded photosensitive chip which does not require an increase in board width for the re-routing of wires around the photosensitive chip includes a circuit board and a reinforced plate at a lower elevation which is connected to the circuit board. The circuit board defines a through hole and a plurality of conductive lines. The conductive lines or the portion of them which are cut off by the location of the through hole accommodating the chip are repeated by connecting lines carried on the reinforced plate, the plurality of connecting lines connects to and continues the conductive lines which are cut off by the hole.