Embedded Chip Heat Dissipation Element for Thermal Management
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Solution Overview
Problem
Embedded chips in electronic products face challenges with effective heat dissipation due to surrounding materials with poor thermal conductivity, leading to potential overheating, reduced lifespan, or damage.
Innovation Solution
An embedded component structure featuring a chip embedded in a circuit board with a heat dissipation element that includes a thermal conductive material layer in direct contact with the chip, providing enhanced thermal conductivity and an electromagnetic shielding effect through a ground terminal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If an embedded chip is surrounded by resin material to reduce carrying area, then the carrying area is reduced, but the thermal conductivity deteriorates causing waste heat accumulation
Solution Approach 1:
The patent changes the thermal conductivity parameter of the surrounding material by replacing conventional resin with a heat dissipation element having superior thermal conductivity. This allows the material to maintain its mechanical support function while dramatically improving heat dissipation capability, thus resolving the contradiction between compact embedding and thermal management
Solution Approach 2:
The patent employs a composite structure where the heat dissipation element is integrated within the circuit board substrate. This composite design combines the mechanical support function of the substrate with the thermal conduction function of the heat dissipation element, enabling both compact embedding and effective heat dissipation simultaneously
2Power
If high performance chip is used to improve processing capability, then the chip performance is improved, but the power consumption increases leading to more waste heat
Solution Approach 1:
The patent converts the harmful waste heat generated by high-performance chips into a manageable thermal flow by providing a dedicated heat dissipation pathway. The heat dissipation element captures and conducts the waste heat away from the chip, transforming the harmful thermal accumulation into a controlled heat transfer process that maintains chip performance while managing energy loss
3Device complexity
If conventional embedding method is used to simplify structure, then the structure is simplified, but the heat dissipation efficiency deteriorates
Solution Approach 1:
The patent merges the heat dissipation function with the embedding structure by integrating the heat dissipation element directly into the circuit board during the manufacturing process. This unified design eliminates the need for separate heat dissipation components while maintaining effective thermal management, thus resolving the contradiction between structural simplicity and heat dissipation efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively dissipates waste heat, preventing overheating and extending chip lifespan while improving signal integrity by reducing electromagnetic interference.
Implementation Method 1
a thermal conductive material layer in direct contact with the chip, providing enhanced thermal conductivity
Data Source
AI summary
An embedded component structure includes a circuit board, a chip, and a heat dissipation element. The chip is embedded in the circuit board. The heat dissipation element surrounds the chip. The chip, the circuit board, and the heat dissipation element are electrically connected. The heat dissipation element includes a first part, a second part, and a third part located between the first part and the second part. The first part is in direct contact with a side wall of the chip. The second part is a ground terminal. A method for manufacturing an embedded component structure is also provided.