Embedded Circuit Board Component Metallization
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Solution Overview
Problem
Existing methods for creating circuit board layers with components have poor electrical properties due to the use of electrically conductive adhesives, making them unsuitable for applications requiring high-quality connections.
Innovation Solution
A circuit board design featuring a conductor-pattern layer and an insulating-material layer with components embedded, using contact elements to connect the conductor-pattern layer to the components, where the contact elements are formed through chemical and/or electrochemical metallization methods within contact openings in the insulating layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If electrically conductive adhesive is used to connect components to conductor patterns, then the manufacturing process is simplified and components can be easily attached, but the electrical properties of the contact are poor
Solution Approach 1:
The invention extracts and removes the electrically conductive adhesive from the contact structure. Instead of using adhesive to create the electrical connection, the patent employs mechanical contact elements (contact openings filled with conductive material) that directly contact the component contact areas, eliminating the adhesive layer that degraded electrical performance
Solution Approach 2:
The invention introduces contact openings as an intermediary structure between the component contact areas and the conductor patterns. These contact openings are filled with conductive material to create a reliable electrical connection pathway, serving as a mediator that achieves both good electrical properties and manufacturability
2Stability of the object's composition
If components are placed inside the insulating material layer during circuit board creation, then the circuit board structure is compact and integrated, but the electrical connection quality deteriorates due to adhesive usage
Solution Approach 1:
The invention segments the connection structure into distinct functional zones: the insulating material layer containing the component, separate contact openings providing electrical pathways, and conductor patterns for signal routing. This segmentation allows each element to perform its function optimally without compromise
Solution Approach 2:
The invention applies local quality by creating contact openings with specific local properties (conductive material filling) at the component contact areas, while the surrounding insulating material maintains its insulating properties. This localized conductive pathway ensures high-quality electrical connection only where needed
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the creation of reliable and high-quality electrical contacts to component contact bumps or areas, enhancing the electrical properties of the circuit board layers and allowing for the addition of layers to various surfaces with conductor patterns.
Implementation Method 1
contact elements between the conductor-pattern layer and contact areas for electrically connecting the conductor-pattern layer and the at least one component, wherein the set of contact elements comprise a plurality of individual contact elements
Implementation Method 2
contact elements between the conductor-pattern layer and contact areas for electrically connecting the conductor-pattern layer and the at least one component
Data Source
AI summary
The document describes a circuit board and an electronic module, including a conductor-pattern layer, an insulating-material layer supporting the conductor-pattern layer, and at least one component inside the insulating-material layer. The component has a plurality of contact areas and the circuit board or electronic module includes contact elements between the conductor-pattern layer and contact areas for electrically connecting the conductor-pattern layer and the at least one component such that at least two of the contact elements are in direct contact with a common contact area.