Embedded Circuit Board with Optical Channels and Heat Dissipation
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Solution Overview
Problem
Conventional photoelectric hybrid circuit boards face challenges in miniaturization due to the surface arrangement of electronic components, which hinders their compact design and efficiency.
Innovation Solution
A method for manufacturing a circuit board that embeds electronic components and integrates optical channels, utilizing a double-sided copper clad laminate with inner circuit layers, conductive pillars, and a heat dissipation block, along with a shielding layer to enhance heat dissipation and signal transmission efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If electronic components are arranged on the surface of the circuit board, then the circuit board can be manufactured with conventional processes, but the circuit board size cannot be minimized
Solution Approach 1:
The patent transitions from surface mounting (2D arrangement) to embedded mounting (3D integration) by forming through-holes and embedding components within the circuit board structure. This dimensional change allows components to be positioned in the thickness direction, enabling miniaturization while maintaining manufacturing feasibility through established embedding processes.
Solution Approach 2:
The patent embeds electronic components within the circuit board structure by forming through-holes and placing components inside these cavities. This nesting approach allows components to be contained within the board's volume rather than occupying surface area, achieving size reduction while using conventional embedding manufacturing techniques.
2Volume of moving object
If electronic components are embedded within the circuit board, then the circuit board can be miniaturized, but heat dissipation becomes more difficult
Solution Approach 1:
The patent extracts heat from embedded components by providing heat dissipation holes that extend from the surface to the embedded component locations. This extraction approach removes the heat dissipation function from the component embedding structure and provides dedicated thermal pathways, allowing components to be miniaturized while maintaining effective heat removal through separate thermal management features.
3Reliability
If optical channels are integrated within the circuit board, then signal transmission efficiency is improved, but manufacturing complexity increases
Solution Approach 1:
The patent merges optical signal transmission channels with the circuit board structure by forming optical through-holes during the board manufacturing process. This integration combines optical and electrical functions within a single structure, improving signal transmission efficiency while using manufacturing processes that are combined with conventional PCB fabrication steps, thereby managing complexity through integration rather than addition.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enables the creation of a lighter, thinner, and smaller circuit board with improved heat dissipation and signal transmission efficiency by embedding electronic components and forming optical channels within the board, while shielding external interference.
Implementation Method 1
a heat dissipation block, wherein one end of the heat dissipation block is in contact with the electronic component
Implementation Method 2
a shielding layer to enhance heat dissipation and signal transmission efficiency by embedding electronic components and forming optical channels within the board, while shielding external interference
Data Source
AI summary
A circuit board includes a substrate, a first inner circuit layer, a second inner circuit layer, a first insulating layer, a first optical fiber extending along a first direction, an optical component, an electrical component, a transparent insulating layer, a first inclined surface, a first reflective layer, a second inclined surface, a second reflective layer, and a second optical fiber extending along a second direction.