Embedded Cluster Manufacturing for Component Carrier Integration
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Solution Overview
Problem
The challenge lies in efficiently embedding multiple electronic components into component carriers, particularly due to issues like height mismatch, irregular resin filling, warpage, differences in physical properties, and alignment problems during the embedding process, which affect the reliability and mechanical robustness of the component carriers.
Innovation Solution
A method involving the formation of a stack with cavities, where a cluster of encapsulated electronic components is placed and embedded within the cavity, allowing for controlled embedding and alignment, thereby overcoming the mentioned challenges.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple electronic components are embedded directly into the component carrier, then the functionality and integration density are improved, but height mismatch, irregular resin filling, and warpage occur
Solution Approach 1:
The patent applies preliminary action by pre-encapsulating multiple electronic components in a common encapsulant to form a cluster before embedding. This pre-preparation ensures uniform structure and dimensions, eliminating height mismatch and irregular resin filling issues that occur when embedding components individually or directly.
Solution Approach 2:
The patent segments the embedding process into two distinct stages: first forming a cluster by encapsulating multiple components together, then embedding the entire cluster as a single unit into the component carrier. This segmentation simplifies the embedding process and maintains manufacturing precision while achieving high integration density.
2Adaptability or versatility
If multiple electronic components with different physical properties are embedded, then the functionality is improved, but differences in physical properties cause embedding defects
Solution Approach 1:
The patent merges multiple heterogeneous electronic components into a single cluster by encapsulating them together in a common encapsulant. This combining approach allows components with different physical properties to be integrated while maintaining uniform external dimensions, ensuring reliable embedding without defects caused by physical property differences.
3Manufacturing precision
If electronic components are embedded with precise alignment, then the electrical connectivity is improved, but alignment problems occur during the embedding process
Solution Approach 1:
The patent applies preliminary action by pre-aligning multiple electronic components within the common encapsulant during cluster formation. This pre-alignment ensures that components are correctly positioned before embedding, eliminating alignment problems during the actual embedding process and simplifying the overall manufacturing complexity.
4Strength
If the component carrier is made mechanically robust, then the reliability under harsh conditions is improved, but heat removal becomes increasingly difficult
Solution Approach 1:
The patent applies local quality by providing mechanical robustness through the component carrier structure while creating localized thermal management solutions through the cluster configuration. The common encapsulant and cavity design enable targeted heat removal pathways from the electronic components without compromising the overall mechanical strength of the component carrier.
Data Source
AI summary
A method of manufacturing a component carrier includes: i) forming a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, with at least one cavity formed in the stack, ii) forming a cluster by encapsulating a first electronic component and a second electronic component in a common encapsulant, and thereafter iii) placing the cluster in the common encapsulant at least partially into the cavity and v) embedding the cluster in the cavity.