Embedded Cold Plate Liquid Cooling for High-Heat-Flux Semiconductors
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Solution Overview
Problem
Traditional cooling methods for semiconductor devices, such as metal heat sinks, are insufficient for high heat flux scenarios, leading to inadequate thermal conductivity and potential overheating, which can cause circuit failures.
Innovation Solution
A direct liquid cooling system is implemented by positioning a cold plate with enclosed channels containing cooling liquid within the die substrate, allowing the liquid to circulate and dissipate heat directly from the semiconductor devices, which can be coupled using bond wires or clips, and optionally using galvanically isolated cold plates for multiple devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional metal heat sinks are used for cooling semiconductor devices, then the cooling system is simple in structure, but the thermal conductivity is insufficient for high heat flux scenarios leading to inadequate heat dissipation
Solution Approach 1:
The patent applies hydraulic cooling by circulating liquid through enclosed channels within the cold plate to efficiently remove heat from semiconductor devices. The cooling liquid flows through the channels, absorbing heat directly at the heat-generating components, thereby resolving the contradiction between simple structure and insufficient heat dissipation capability.
Solution Approach 2:
The patent merges the cooling function directly into the substrate by integrating enclosed cooling channels within the cold plate structure. This combination eliminates the need for separate external cooling components while achieving superior heat dissipation, thus improving temperature control without significantly increasing overall system complexity.
2Reliability
If isolation components are used to separate semiconductor devices and cooling components, then electrical isolation is achieved, but thermal resistance increases reducing cooling effectiveness
Solution Approach 1:
The patent uses the cooling liquid as an intermediary that provides both thermal conduction and electrical isolation simultaneously. The liquid flows through enclosed channels in direct contact with or proximate to the semiconductor devices, enabling efficient heat transfer while maintaining electrical isolation between the cooling system and the electronic components.
Solution Approach 2:
The cold plate employs composite construction combining thermally conductive materials for the plate structure with electrically insulating cooling liquid within the channels. This composite approach allows the system to achieve both low thermal resistance for effective cooling and high electrical isolation for safety and reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively maintains semiconductor device temperatures, preventing overheating and enhancing thermal conductivity, thereby improving reliability and performance.
Implementation Method 1
configured to at least partially dissipate heat using the cooling liquid from the semiconductor device during operation of the semiconductor device
Implementation Method 2
enhancing thermal conductivity, thereby improving reliability and performance
Data Source
AI summary
A system and associated method for direct liquid cooling of semiconductor devices. The system includes at least one semiconductor device is positioned on a die substrate and at least one cold plate disposed within the die substrate and containing a cooling liquid. The cold plate is positioned proximate to the semiconductor device and configured to at least partially dissipate heat using the cooling liquid from the semiconductor device during operation of the semiconductor device.